A kind of epoxy resin composition and its preparation method and application
An epoxy resin, epoxy resin curing technology, applied in the field of resin materials, can solve the problems of long infiltration time, mechanical decline of composite materials, poor infiltration, etc., and achieve the effect of excellent mechanical properties and high mechanical properties
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Embodiment 1
[0089] This embodiment provides an epoxy resin curing composition, which is formed by mixing an epoxy resin composition with a mass ratio of 100:31 and a curing agent;
[0090] The epoxy resin composition comprises the following components according to parts by weight:
[0091]
[0092] The curing agent comprises the following components according to parts by weight:
[0093] Polyetheramine curing agent (Huntsman-230) 70 parts by weight
[0094] Alicyclic amine curing agent (diaminodicyclohexylmethane) 25 parts by weight
[0095] Tertiary amine accelerator (K54 of Air Chemicals) 5 parts by weight;
[0096]The preparation method of the epoxy resin composition is as follows: adding the formula amount of bisphenol A epoxy resin, bisphenol F epoxy resin, diluent and auxiliary agent to the stirring device, stirring (main stirring 60 r / min, high speed). stirring at 800 r / min), vacuum defoaming, and filtration to obtain the epoxy resin composition.
[0097] The preparation met...
Embodiment 2
[0099] The difference from Example 1 is that the bisphenol A epoxy resin is 60 parts by weight, the bisphenol F epoxy resin is 30 parts by weight, and the ratio of the two is 2:1.
Embodiment 3
[0101] The difference from Example 1 is that the bisphenol A epoxy resin is 60 parts by weight, the bisphenol F epoxy resin is 20 parts by weight, and the ratio of the two is 3:1.
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