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3D printing method for circuit board and 3D printed circuit board

A 3D printing and circuit board technology, which is applied in the direction of printed circuit, circuit substrate material, printed circuit manufacturing, etc., can solve the problems of signal integrity, large insertion loss, and many holes, so as to improve integrity and flatness Effect

Active Publication Date: 2019-12-13
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors of the present application have discovered in long-term research and development that this copper-free substrate is mainly composed of polymers, so although the appearance is smooth, there are actually many holes. If copper transmission lines are printed directly on it, it is easy for copper particles to fall into the polymers. In the cavity, it can be seen from the skin effect that when the frequency of the signal is higher, the signal will be transmitted closer to the surface of the conductor, so the more uneven the surface, the easier it is to cause the insertion loss to increase and signal integrity problems to occur

Method used

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  • 3D printing method for circuit board and 3D printed circuit board
  • 3D printing method for circuit board and 3D printed circuit board
  • 3D printing method for circuit board and 3D printed circuit board

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0019] This application provides a method for 3D printing circuit boards, please refer to figure 1 , figure 1 It is a flowchart of a method for 3D printing a circuit board provided by an embodiment of the present application. The method comprises the steps of:

[0020] S101 , printing an insulating layer on a substrate to form a flat layer that can improve the flatness of a printed circuit.

[0021] The substrate in this embodiment is an insulating copper-f...

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Abstract

The invention discloses a 3D printing method for a circuit board and a 3D printed circuit board. The method comprises the following steps of: printing an insulating layer on a substrate to form a flatlayer that can improve the flatness of the printed circuit, and printing a circuit layer on the surface of one side, deviating from the substrate, of the flat layer. By the above method, the flatnessof the printed circuit can be improved, and the signal transmission effect of the printed circuit is improved.

Description

technical field [0001] The present application relates to the technical field of circuit board processing, in particular to a method for 3D printing circuit boards and 3D printing circuit boards. Background technique [0002] Due to the current high price of 3D (English 3Dimensions, that is, three-dimensional) printing materials, it does not need to be printed as a substrate material, so the 3D printing circuit only prints the copper of PCB (Printed Circuit Board Chinese name printed circuit board, also known as printed circuit board). line, but the raw material is changed from a copper-clad substrate to a copper-free substrate. [0003] The inventors of the present application have discovered in long-term research and development that this copper-free substrate is mainly composed of polymers, so although the appearance is smooth, there are actually many holes. If copper transmission lines are printed directly on it, it is easy for copper particles to fall into the polymers....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/12H05K1/03H05K1/09
CPCH05K1/0353H05K1/097H05K3/0011H05K3/1275
Inventor 刘诗涛李智韩雪川崔荣
Owner SHENNAN CIRCUITS