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Cooking utensil, cooking method and computer readable storage medium

A technology of cooking utensils and components, which is applied in cooking utensils, household utensils, kitchen utensils, etc., and can solve problems that affect the user's taste, affect the user's health, and food deterioration.

Active Publication Date: 2019-12-17
FOSHAN SHUNDE MIDEA ELECTRICAL HEATING APPLIANCES MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the related art, the cooking utensil may contain food during the standby process, but the temperature of the inner pot is too high, which will cause the food to deteriorate, which not only seriously affects the taste of the user, but also affects the health of the user.

Method used

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  • Cooking utensil, cooking method and computer readable storage medium
  • Cooking utensil, cooking method and computer readable storage medium
  • Cooking utensil, cooking method and computer readable storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] like figure 1 As shown, in any of the above technical solutions, preferably, the cooling assembly is assembled between the outer wall of the inner pot 102 and the inner wall of the outer pot 104 , and the fan 108 is detachably assembled on the inner wall of the outer pot 104 .

[0062] In this technical solution, by arranging the refrigeration assembly between the outer wall of the inner pot 102 and the inner wall of the outer pot 104, on the one hand, since the heating assembly is usually arranged at the inner bottom of the outer pot 104, the cooling assembly The installation position has less interference with the installation position of the heating assembly. On the other hand, the air duct hole 110 can be correspondingly arranged on the side wall of the outer pot 104, that is, away from the heating assembly, so as to reduce the heat in the cooking process through the air. Channel hole 110 drains.

[0063] In any of the above technical solutions, preferably, the ref...

Embodiment 2

[0066] like figure 2 As shown, in any of the above technical solutions, preferably, the refrigeration assembly is assembled between the outer bottom wall of the inner pot 102 and the inner bottom wall of the outer pot 104 .

[0067] In this technical solution, by placing the cooling assembly between the outer bottom wall of the inner pot 102 and the inner bottom wall of the outer pot 104, due to the effect of gravity, when the inner pot 102 is put into the outer pot 104, it will naturally lean against the Above the refrigeration assembly, the structure of the refrigeration assembly is simplified. Further, in order to improve the heat dissipation effect of the hot end of the semiconductor refrigeration assembly, air duct holes 110 are arranged on the bottom wall of the shell of the outer pot 104 and the side wall near the bottom, or at the bottom of the outer pot 104 A horizontally penetrating cooling air duct 124 is provided.

[0068] In any of the above technical solutions,...

Embodiment 3

[0073] like image 3 As shown, the cooking method according to the embodiment of the present invention includes: step S302, in the specified working mode, detect the working temperature of the inner pot according to the preset time interval; step S304, when the detected working temperature is higher than the preset When the working temperature is high, the refrigeration component is triggered to cool down the inner pot, and at the same time, the fan is controlled to blow air to dissipate heat.

[0074] In this technical solution, when the operating temperature is detected to be higher than the preset operating temperature, the refrigeration component is triggered to cool down the inner pot, and at the same time, the fan is controlled to blow air to dissipate heat. On the one hand, the cold end of the semiconductor refrigeration element Cooling the inner pot can lower the operating temperature of the inner pot to the refrigerated temperature, so as to improve the freshness and ...

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Abstract

The invention provides a cooking utensil, a cooking method and a computer readable storage medium. The cooking utensil comprises a refrigerating assembly arranged between an inner pot and an outer pot; the refrigerating assembly comprises a semiconductor refrigerating element and a fan; the cold end of the semiconductor refrigerating element is close to the outer side wall of the inner pot; the hot end of the semiconductor refrigerating element is close to a shell of the outer pot; the semiconductor refrigerating element is used for cooling the inner pot; and the fan is arranged between the hot end of the semiconductor refrigerating element and the shell of the outer pot and is used for carrying out air blowing cooling on the hot end of the semiconductor refrigerating element. By means ofthe technical scheme, the freshness, the food hygiene and the eating taste of cooking food materials can be improved, and the cooking experience of a user is comprehensively improved.

Description

technical field [0001] The present invention relates to the technical field of cooking, in particular, to a cooking utensil, a cooking method and a computer-readable storage medium. Background technique [0002] As one of the most important household appliances, cooking appliances are developed to provide users with more hygienic and delicious cooked food. [0003] In the related art, the cooking utensil may contain food during the standby process, but if the temperature of the inner pot is too high, the food will deteriorate, which not only seriously affects the taste of the user, but also affects the health of the user. Contents of the invention [0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art. [0005] To this end, an object of the present invention is to provide a cooking appliance. [0006] Another object of the present invention is to provide a cooking method. [0007] Another object of th...

Claims

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Application Information

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IPC IPC(8): A47J27/00A47J36/00
CPCA47J27/00A47J36/00
Inventor 黄德万
Owner FOSHAN SHUNDE MIDEA ELECTRICAL HEATING APPLIANCES MFG CO LTD
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