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Adjustable shielding device and electroplating shielding method implemented thereby

A shielding device and adjustable technology, which is applied in the direction of current insulation devices, circuits, electrolytic components, etc., can solve the problems that the uniformity of the coating thickness of the entire wafer cannot be guaranteed, and achieve the effect of wide versatility and uniformity

Pending Publication Date: 2019-12-24
新阳硅密(上海)半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide an adjustable shielding device and an electroplating shielding method realized by using it in order to overcome the defect that the uniformity of the coating thickness of the entire wafer cannot be guaranteed in the prior art

Method used

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  • Adjustable shielding device and electroplating shielding method implemented thereby
  • Adjustable shielding device and electroplating shielding method implemented thereby
  • Adjustable shielding device and electroplating shielding method implemented thereby

Examples

Experimental program
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Effect test

Embodiment 1

[0050] Such as figure 1 As shown, this embodiment discloses an adjustable shielding device, which includes a shielding plate 1 and four shielding plates 2 .

[0051] The shielding plate 1 is a structure with a hollow in the middle. Wherein, the shielding plate 1 has a hollow center portion 11 and several hollow arc portions 12 , and the arc portions 12 are arranged on the periphery of the center portion 11 .

[0052] The shielding plate 2 corresponds to each arc portion 12 respectively, and the shielding plate 2 moves relative to the arc portion 12 to adjust the covering area of ​​the arc portion 12 .

[0053] Such as figure 2 As shown, the arc portion 12 in this embodiment is arranged at a 45-degree diagonal angle of the shielding plate 1 . The angle θ corresponding to the arc portion 12 is 45-90 degrees, the hole width a is 10-20 mm, and the distance b between the arc portion 12 and the center portion 11 is 3-10 mm. Further preferably, the angle θ corresponding to the arc...

Embodiment 2

[0062] Such as Figure 4 As shown, this embodiment discloses an adjustable shielding device, which includes a shielding plate 1 and four shielding plates 2 .

[0063] The shielding plate 1 is a structure with a hollow in the middle. Wherein, the shielding plate 1 has a hollow center portion 11 and several hollow arc portions 12 , and the arc portions 12 are arranged on the periphery of the center portion 11 .

[0064] The shielding plate 2 corresponds to each arc portion 12 respectively, and the shielding plate 2 moves relative to the arc portion 12 to adjust the covering area of ​​the arc portion 12 .

[0065] In this embodiment, the adjustable shielding device further includes a plurality of lever arms 3, and the lever arms 3 serve as adjustment mechanisms to drive each shielding plate 2 to move relative to the arc portion 12, thereby adjusting the covering area of ​​the arc portion 12. Wherein, except the lever arm 3 of this embodiment, the adjustment mechanism may be any...

Embodiment 3

[0071] Such as Figure 5 and Figure 6 As shown, this embodiment discloses an adjustable shielding device, which includes a shielding plate 1 and four shielding plates 2 .

[0072] The shielding plate 1 is a structure with a hollow in the middle. Wherein, the shielding plate 1 has a hollow center portion 11 and several hollow arc portions 12 , and the arc portions 12 are arranged on the periphery of the center portion 11 .

[0073] The shielding plate 2 corresponds to each arc portion 12 respectively, and the shielding plate 2 moves relative to the arc portion 12 to adjust the covering area of ​​the arc portion 12 .

[0074] Such as Figure 5 and Figure 6 As shown, the adjustable shielding device further includes a plurality of lever arms 3, which serve as adjustment mechanisms to drive each shielding plate 2 to move relative to the arc portion 12, thereby adjusting the covering area of ​​the arc portion 12. Wherein, except the lever arm 3 of this embodiment, the adjustm...

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PUM

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Abstract

The invention discloses an adjustable shielding device and an electroplating shielding method implemented thereby. The adjustable shielding device comprises a shielding plate and a plurality of baffleplates. The shielding plate is provided with a hollowed center-of-circle part and a plurality of hollow arc parts and the arc parts are arranged on the periphery of the center-o-circle part; and thebaffle plates correspond to the arc parts, separately, and the baffle plates move relative to the arc parts so as to adjust the covering areas of the arc parts. By arranging the arc parts, uniformityof the wafer plating thickness can be guaranteed. The position of the hollowed part on the shielding plate relative to a whole cathode workpiece can be adjusted by means of the baffle plates, so thatthe adjustable shielding device is wide in universality.

Description

technical field [0001] The invention relates to wafer electroplating, in particular to an adjustable shielding device for wafer electroplating and an electroplating shielding method realized by the same. Background technique [0002] Wafer plating is an important process step in the chip manufacturing wet process. Wafer plating has horizontal plating and vertical plating. In the wafer electroplating process, the uniformity of the coating thickness is an important aspect of the electroplating effect, and various electroplating equipment manufacturers are constantly improving their equipment to improve the uniformity of the coating thickness. [0003] At present, there are two types of wafers for chip manufacturing: 8 inches (200mm diameter) and 12 inches (300mm diameter). The larger the wafer, the more difficult it is to achieve uniform thickness across the entire wafer during electroplating. [0004] There are many and complicated factors affecting the uniformity of the c...

Claims

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Application Information

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IPC IPC(8): C25D7/12C25D17/00
CPCC25D7/12C25D17/001C25D17/008
Inventor 史蒂文·贺·汪
Owner 新阳硅密(上海)半导体技术有限公司
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