bump structure

Abstract

The invention discloses a bump structure, which includes a bump body, the bump body extends along a first direction, and the bump body has two sides respectively in a second direction perpendicular to the first direction. one side surface; and a plurality of reinforcing units formed on the side surface of the bump body.

Description

Technical field [0001] The present invention relates to a bump structure, in particular, it relates to a method for increasing the bonding strength of the bump structure between the integrated circuit chip with the bumps. Background technique [0002] In response to an integrated circuit (integrated circuit, IC) chip performance (e.g.: increase resolution), or to conform to the needs of compact size components, circuit chip design must be precision, so in the design of the corresponding packaging technology, bumps (Bump ) size must also move towards a narrowing trend. As the size of the bumps and the reduction products of high order guide, making the consumption of raw materials when the bumps (e.g. gold bumps production consumed gold) and production costs can be greatly reduced. For example, at this stage of high pin count chips (e.g., a display panel driver chip) size has been limited by the size of the bump, by making smaller size bumps only direct reduction of raw materials c...

AI Technical Summary

Problems solved by technology

[0003] However, since the bumps are attached to the chip by a vacuum pressure, when the size of the bumps shrinks, the bonding strength between the bumps and the chip will decrease with the reduction of the bonding area, causing the bumps to be difficult for wafer dicing, Wafer probing, during bonding, flipping wafers, cleaning processes at the back end of manufacturing, or debonding or peeling during shipping

In particular, those skilled in the art can know that the bumps are generally formed in an elongated shape, so as figure 1 As shown, if the bump GB extends along the X-axis direction, when the bump GB is subjected to a lateral force S perpendicular to the X-axis direction, the bonding surface between the bump GB and the chip is prone to a peeling phenomenon, and this The frequency of this peeling phenomenon will increase dramatically as the bump size shrinks, which will seriously affect the product yield

For example, after the wafer is cut, it is necessary to rinse the debris on the wafer. The physical impact of the water pressure on the bumps during the wafer flushing may cause the bumps to fall off.

In addition, during the grinding process of the chip, the bonding process with other components or the vibration, shaking, etc. during the transportation process, the bumps may be peeled off or fall off.

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