Solder ball welding disc cleaning mechanism

Abstract

The invention provides a solder ball welding disc cleaning mechanism. The solder ball welding disc cleaning mechanism comprises a lower base plate, a ball separating disc and a rotary driving mechanism, a material falling port and a slagging notch are formed in the upper surface of the lower base plate at intervals, the ball separating disc is arranged on the upper surface of the lower base plate,a plurality of ball separating holes are formed in the ball separating disc in the circumferential direction, the material falling port and the slagging notch are right opposite to the circumferential line where the ball separating holes are located, the output end of the rotary driving mechanism is connected to the ball separating disc, and the ball separating disc is driven by the rotary driving mechanism to rotate, so that solder balls not falling into the material falling ports yet in the ball separating holes fall to the slagging notch. According to the solder ball welding disc cleaningmechanism, when the solder balls do not effectively fall into the material falling port and are taken away by the ball separating disc, due to the fact that the slagging notch which is right oppositeto the circumferential line where the ball separating holes are located is further formed in the upper surface of the lower base plate, the solder balls which are taken away by the ball separating disc can fall to the slagging notch, so that the solder balls remaining on the ball separating holes of the ball separating disc can be automatically cleaned, cleaning is carried out without disassembling, and therefore the ball feeding efficiency is improved, and the phenomenon that the ball separating disc is jammed and cannot rotate can be avoided.

Description

technical field [0001] The invention relates to the technical field of solder ball soldering, in particular to a solder ball soldering disk cleaning mechanism. Background technique [0002] At present, soldering is very popular in industrial production. With the development of technology and the rapid increase of labor costs, automatic solder ball welding equipment has replaced the traditional manual soldering method of electric soldering iron and has become the main direction of soldering technology development. [0003] In the ball distribution mechanism of the existing solder ball automatic soldering equipment, it usually includes a substrate, a disc and a bottom plate in sequence from top to bottom, and a first channel is provided on the substrate, and the first channel communicates with the ball storage space of the ball storage cylinder , the disc is provided with a ball distribution hole, and the bottom plate is provided with a second channel connected to the solderin...

AI Technical Summary

Problems solved by technology

However, when the disc rotates to supply balls, there is a situation that the solder balls do not effectively fall into the second channel (failure) and are taken away by the disc, and the balls remain in the ball distribution holes of the disc, causing friction between the solder balls and the substrate and bottom plate , leading to the following harms: friction increases the torque, and even blocks the disc, causing the disc to fail to continue to rotate; damage the surface of the substrate and the bottom plate, reduce the accuracy of the ball supply, and reduce the service life of the ball distribution mechanism; the worn out solder balls will cause Tin slag causes pollution, and even incomplete solder balls are sent to the ball position for welding again, resulting in defective welding products; the polluted ball distribution mechanism needs to be disassembled and cleaned, which takes a long time and needs to be reinstalled and debugged, which affects production efficiency

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