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Plane grinding compensation method, device, equipment and storage medium

A compensation method and plane equation technology, applied in grinding devices, metal processing equipment, grinding machine tools, etc., can solve problems such as time-consuming and affect production efficiency, and achieve the effect of improving grinding efficiency and avoiding grinding data.

Active Publication Date: 2021-06-01
深圳市精诚信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Debug according to the actual grinding effect, and continue to drill a little deeper where the grinding cannot be achieved, but such attempts are very time-consuming and affect production efficiency

Method used

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  • Plane grinding compensation method, device, equipment and storage medium
  • Plane grinding compensation method, device, equipment and storage medium
  • Plane grinding compensation method, device, equipment and storage medium

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Embodiment Construction

[0039] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0040] refer to figure 1 , in one embodiment of the present invention, a plane grinding compensation method is proposed, which is applied to an intelligent grinding machine, and the method includes:

[0041] Step S1, when polishing the point to be polished on the surface to be polished, obtain the coordinate values ​​of the X and Y axes of the point to be polished, and obtain the plane equation of the surface to be polished where the point to be polished is located;

[0042] In this embodiment, the surface to be polished is an uneven surface that needs to be polished, such as the surface of a BGA chip. Obtaining the X-axis and Y-axis coordinates of the point to be polished is based on analyzing each instruction of the G code in the controller to obtain the tool position of the current tool after executing the current...

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PUM

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Abstract

The invention relates to the field of intelligent grinding, and discloses a plane grinding compensation method, device, equipment and storage medium. Wherein, the method includes: when the point to be polished on the surface to be polished is polished, obtaining the coordinate values ​​of the X and Y axes of the point to be polished, and obtaining the plane equation of the surface to be polished where the point to be polished is located; Calculate the Z-axis coordinate value of the point to be polished according to the coordinate values ​​of the X and Y axes and the plane equation; determine the compensation value for polishing the point to be polished according to the Z-axis coordinate value; The offset value determines how deep the knife will go when grinding. According to the method disclosed in the invention, the cutting depth of the knife during grinding is automatically compensated, avoiding manual fine-tuning of the grinding data of the grinding surface, and improving the grinding efficiency.

Description

technical field [0001] The invention relates to the field of intelligent grinding, in particular to a plane grinding compensation method, device, equipment and storage medium. Background technique [0002] In the working scene of grinding machine processing, the processing is not ideal because the fixture is not level or the surface of the grinding object is deformed and uneven. Especially when polishing BGA chips, if the surface of the chip is uneven, if the coordinates of a certain point are used as the Z-axis machining zero point, there will be too much or too little polishing locally, resulting in unsatisfactory polishing effects. It will cause the circuit board to be scrapped and cause economic loss. In order to solve this problem, currently only fine-tuning the polishing data on the chip surface can be done manually. Debug according to the actual grinding effect, and continue to drill a little deeper where the grinding cannot be achieved, but such attempts are very t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/005B24B37/04H01L21/306
CPCB24B37/005B24B37/042H01L21/30625
Inventor 卢意黄书林罗成
Owner 深圳市精诚信息科技有限公司