Plane polishing compensation method and device, equipment and storage medium
A compensation method and plane equation technology, applied in grinding devices, metal processing equipment, grinding machine tools, etc., can solve the problems of time-consuming and affect production efficiency, and achieve the effect of improving grinding efficiency and avoiding grinding data.
Active Publication Date: 2020-01-03
深圳市精诚信息科技有限公司
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Problems solved by technology
Debug according to the actual grinding effect, and continue to drill a little deeper where the grinding cannot be achieved, but such attempts are very time-consuming and affect production efficiency
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Embodiment Construction
[0039] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0040] refer to figure 1 , in one embodiment of the present invention, a plane grinding compensation method is proposed, which is applied to an intelligent grinding machine, and the method includes:
[0041] Step S1, when polishing the point to be polished on the surface to be polished, obtain the coordinate values of the X and Y axes of the point to be polished, and obtain the plane equation of the surface to be polished where the point to be polished is located;
[0042] In this embodiment, the surface to be polished is an uneven surface that needs to be polished, such as the surface of a BGA chip. Obtaining the X-axis and Y-axis coordinates of the point to be polished is based on analyzing each instruction of the G code in the controller to obtain the tool position of the current tool after executing the current...
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The invention relates to the field of intelligent polishing and discloses an intelligent polishing compensation method and device, equipment and a storage medium. The method comprises the steps that when a point to be polished on a surface to be polished is polished, X-axis and Y-axis coordinate values of the polishing point to be polished are obtained, and a plane equation of the surface, where the point to be polished is located, to be polished is obtained; Z-axis coordinate values of the point to be polished are obtained according to the X-axis and Y-axis coordinate values and the plane equation; a compensation value for polishing the point to be polished is determined according to the Z-axis coordinate values; and the cutter feeding depth in polishing is determined according to the compensation value. According to the method, compensation for the cutting feeding depth in polishing is automatically carried out, manual fine-adjustment of polishing data of the polishing surface is avoided, and polishing efficiency is improved.
Description
technical field [0001] The invention relates to the field of intelligent grinding, in particular to a plane grinding compensation method, device, equipment and storage medium. Background technique [0002] In the working scene of grinding machine processing, the processing is not ideal because the fixture is not level or the surface of the grinding object is deformed and uneven. Especially when polishing BGA chips, if the surface of the chip is uneven, if the coordinates of a certain point are used as the Z-axis machining zero point, there will be too much or too little polishing locally, resulting in unsatisfactory polishing effects. It will cause the circuit board to be scrapped and cause economic loss. In order to solve this problem, currently only fine-tuning the polishing data on the chip surface can be done manually. Debug according to the actual grinding effect, and continue to drill a little deeper where the grinding cannot be achieved, but such attempts are very t...
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IPC IPC(8): B24B37/005B24B37/04H01L21/306
CPCB24B37/005B24B37/042H01L21/30625
Inventor 卢意黄书林罗成
Owner 深圳市精诚信息科技有限公司