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Method for repairing fuse circuit of chip

A chip and circuit technology, applied in the field of repairing the fuse circuit of the chip, can solve the problem of low repair success rate, achieve the effect of improving the repair rate and reducing the window area

Inactive Publication Date: 2020-01-03
HUA HONG SEMICON WUXI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] This application provides a method for repairing the fuse circuit of the chip, which can solve the problem of low repair success rate when repairing the fuse line in the related art

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  • Method for repairing fuse circuit of chip
  • Method for repairing fuse circuit of chip
  • Method for repairing fuse circuit of chip

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Embodiment Construction

[0038] The technical solutions in this application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0039] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific orientati...

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Abstract

The invention discloses a method for repairing a fuse circuit of a chip, and relates to the field of semiconductor manufacturing. The method comprises the following steps: obtaining the position of the fuse circuit on the chip according to layout design information corresponding to the chip; polishing the side surface of the chip corresponding to the position of the fuse circuit; determining two breakpoint positions of a fuse line on the polished side surface of the chip; selectively etching the two breakpoint positions; and depositing metal Pt on the polished side surface of the chip, and connecting the metal Pt with the two breakpoints of the fuse line. The problems of damages to other circuit functions of the chip and low repairing rate of existing fuse circuit repairing method are solved; and the effects of reducing the windowing area, not damaging the circuit structure of the upper layer of the fuse line and increasing the repair rate are achieved.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a method for repairing a fuse circuit of a chip. Background technique [0002] Currently, integrated circuit chips, especially smart card platform chips, are provided with fuse circuits. The fuse is generally a signal line related to function control inside the chip, which provides the backdoor function of the chip during the debugging stage. The fuse line 12 of each chip 11 extends in the dicing groove 13 on the wafer, as figure 1 As shown, the fuse line can be cut off during the process of chip reduction, and the backdoor function can be closed. [0003] However, there are occasional failures in the back-end application process. In order to debug the faulty chip, the fuse circuit of the chip needs to be repaired. The fuse lines of most existing products use poly (polysilicon) layers. The repair of the circuit from the surface needs to destroy ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768H01L23/525
CPCH01L21/76892H01L23/5256
Inventor 徐晓俊
Owner HUA HONG SEMICON WUXI LTD
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