Manufacturing method of 2.5 D bent circuit board

Abstract

The invention provides a manufacturing method of a 2.5 D bent circuit board. The method comprises steps that a circuit is manufactured at a bending area position by adopting the acid corrosion processaccording to customer requirements; a strippable material is fixed in the bending area; prepregs with low gummosis are adopted, and the number of the prepregs is determined according to thickness ofa medium; a CO2 laser cutting method is adopted, the principle that the CO2 laser cutting method does not move when metal is touched, the periphery of the bending area is cut to the position of an inner-layer line according to the customer requirements, and accurate control is achieved; the unneeded position which is cut open is uncovered through a certain pressure by adopting a sucker; a film isremoved by utilizing liquid medicine; electroplating is conducted; flexible ink is formed on a copper layer on the surface of the bending area so as to protect the copper layer and achieve the bendingeffect. The method is advantaged in that performance and the strength of the bending area are improved to 30 times or above from 1-2 times of the traditional process, and the installation effect is achieved.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a 2.5D bent circuit board. Background technique [0002] The current technical production technology adopts ordinary materials + blind gong CNC machining method, or uses deep-controlled gong and other processes to join together, and at the same time cannot achieve absolute tolerance control, and cannot meet the multiple bending requirements of existing products. For example: [0003] (1) Through CNC blind gong or deep-controlled gong, the half-bending material at the bend will be damaged and the bending effect will be affected (2) The half-bending material is not used at the bend, and the number of bends cannot be reached [0004] (3) There is no need to use special soft ink at the bend, which cannot meet the bending requirements [0005] It can be seen that the conventional circuit board production technology cannot meet the production requi...

AI Technical Summary

Problems solved by technology

[0002] The current technical production technology adopts ordinary materials + blind gong CNC machining method, or uses deep-controlled gong and other processes to join together, and at the same time cannot achieve absolute tolerance control, and cannot meet the multiple bending requirements of existing products. For example:

[0003] (1) Through CNC blind gong or deep-controlled gong, the half-bending material at the bend will be damaged and the bending effect will be affected (2) The half-bending material is not used at the bend, and the number of bends cannot be reached

[0004] (3) There is no need to use special soft ink at the bend, which cannot meet the bending requirements

[0005] It can be seen that the conventional circuit board production technology cannot meet the production requirements of 2.5D (between rigid board and flexible board bending, only 90-degree bending, not 180-degree bending) circuit boards, especially bending Folding lines, etching, pressing, molding, surface treatment and other processes

Images