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Step impedance design method for high-speed photoelectric hybrid interconnection channel

An optoelectronic hybrid, interconnecting channel technology, applied in electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of reducing transmission channel reflection, without the combined consideration of signal reflection and loss in transmission channel, to reduce loss, extend The effect of transmission distance

Active Publication Date: 2020-01-10
JIANGNAN INST OF COMPUTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the design method of optoelectronic interconnection channel impedance adopts 100 ohm impedance only to reduce the reflection of the transmission channel, and does not consider the signal reflection and loss of the transmission channel comprehensively.

Method used

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  • Step impedance design method for high-speed photoelectric hybrid interconnection channel
  • Step impedance design method for high-speed photoelectric hybrid interconnection channel

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Embodiment Construction

[0027] The following are specific examples of the present invention to further describe the technical solutions of the present invention, but the present invention is not limited to these examples.

[0028] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement and steps of the modules and steps set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0029] At the same time, it should be understood that, for the convenience of description, the processes in the drawings are not only performed individually, but multiple steps are performed intersecting with each other.

[0030] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0031] Technologies, methods and systems known t...

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Abstract

The invention provides a step impedance design method for a high-speed photoelectric hybrid interconnection channel, which relates to the technical field of PCB design. The method comprises the following steps of: S1, acquiring the inner terminating impedance of an optical cable, S2, acquiring a transmission channel impedance difference threshold, S3, determining chip terminating impedance, S4, determining impedance of an electrical interconnection channel, and S5, determining the impedance of an optical interconnection channel printed wire. According to the step impedance design method for the high-speed photoelectric hybrid interconnection channel, the optical cable terminating impedance, the chip terminating impedance, the transmission channel printed wire impedance, transmission channel reflection and loss are integrated, the impedance of the electrical interconnection channel and the impedance of the optical interconnection channel are optimized and determined respectively, the loss of the electrical interconnection channel can be effectively reduced within the reflection range allowed by the transmission channel, and the transmission distance of the electrical interconnectionchannel is prolonged.

Description

technical field [0001] The present invention relates to the technical field of PCB design, [0002] In particular, the invention relates to a method for designing a ladder impedance of a high-speed photoelectric hybrid interconnection channel. Background technique [0003] With the continuous improvement of high-speed serial signal transmission rate, high-performance network systems generally use electrical interconnection transmission for short-distance transmission, and optical cable transmission for long-distance transmission between cabinets, which requires network plug-in boards to support both electrical and optical cable interconnection transmission . High-speed signals above 10Gbps generally adopt differential signal transmission, and its quality is mainly analyzed by signal integrity methods. The main signal integrity problems include reflection, loss, crosstalk, etc. Loss is due to the signal energy loss caused by the resistance characteristics of the printed wir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00
Inventor 郑浩张弓李川王彦辉胡晋王玲秋李滔
Owner JIANGNAN INST OF COMPUTING TECH