Monitoring component, system and method based on running state of system-in-package device
A system-level packaging and operating state technology, applied to instruments, measuring electronics, measuring devices, etc., can solve problems such as inaccurate results of SiP devices, and achieve the effect of improving accuracy
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[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
[0031] Based on the above purpose, an embodiment of the present invention provides a SiP (System In a Package system-in-package) device function operation status monitoring component. In one implementation, such as figure 1 As shown, the monitoring assembly includes a test board 1 for installing a system-in-package device 4, a main control board 2 and a PC (Personal Computer, personal computer) 3, and the test board 1 is connected to the main control board 2 with signals, so The main control board 2 provides power, a clock signal and a reset signal for the test board 1, and controls the test process of the test board 1 to the system-in-package device 4, and the main control board 2 is connected to the PC3 signal, The PC3 ...
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