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Semiconductor package

A semiconductor and packaging technology, applied in the field of semiconductor packaging, can solve the problems of increased electrical noise, large distance between semiconductor chips and passive components, and large electromagnetic interference.

Active Publication Date: 2020-01-14
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This approach has advantages in terms of cost, but requires a wide mounting area in order to maintain the minimum spacing between components, the electromagnetic interference (EMI) between components is large, and the distance between semiconductor chips and passive components is large, making electrical noise increase

Method used

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  • Semiconductor package
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Examples

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Embodiment Construction

[0024] Hereinafter, exemplary embodiments in the present disclosure will be described with reference to the accompanying drawings. In the drawings, the shapes, sizes, etc. of components may be exaggerated or reduced for clarity.

[0025] Here, for convenience, with respect to the cross-section of the drawings, the lower side, lower portion, lower surface, etc. are used to point to the downward direction, and the upper side, upper portion, upper surface, etc. are used to point to the direction opposite to the downward direction. However, these directions are defined for convenience of description, and the claims are not specifically limited by the directions defined above, and the concepts of "upper" and "lower" may be changed at any time.

[0026] In the description, the meaning of "connection" of a component to another component conceptually includes indirect connection through an adhesive layer as well as direct connection between two components. In addition, conceptually, ...

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Abstract

The invention provides a semiconductor package that includes: a frame having first and second through-holes spaced apart from each other; passive components disposed in the first through-hole; a semiconductor chip disposed in the second through-hole and having an active surface on which connection pads are disposed and an inactive surface opposing the active surface; a first encapsulant covering at least portions of the passive components and filling at least portions of the first through-hole; a second encapsulant covering at least portions of the semiconductor chip and filling at least portions of the second through-hole; and a connection structure disposed on the frame, the passive components, and the active surface of the semiconductor chip and including wiring layers electrically connected to the passive components and the connection pads of the semiconductor chip. The second encapsulant has a higher electromagnetic wave absorption rate than that of the first encapsulant.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2018-0078236 filed with the Korean Intellectual Property Office on July 5, 2018, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a semiconductor package in which a semiconductor chip is mounted together with a plurality of passive components in a single package and modularized. Background technique [0003] As the size of displays of mobile devices has increased, the necessity to increase the capacity of batteries has increased. As the capacity of batteries has increased, the area occupied by the batteries in mobile devices has increased, and thus there has been a need to reduce the size of printed circuit boards (PCBs). Accordingly, the area where components are mounted has decreased, so that interest in modularity has continued to increase. [0004] On the other hand, an example of the related ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552
CPCH01L23/552H01L23/3128H01L23/3135H01L23/16H01L23/562H01L21/568H01L2221/68372H01L2221/68345H01L21/561H01L21/6836H01L23/5389H01L23/49816H01L23/4334H01L23/36H01L24/20H01L2224/04105H01L2924/19105H01L2924/3025H01L2224/12105H01L25/16H01L24/19H01L2224/18H01L23/29H01L23/485H01F1/017H01L23/06H01L23/13H01L24/08H01L25/18H01L2224/08225H01L23/49822H01L23/295H01L23/481H01L23/49894
Inventor 金亨俊李尚锺徐允锡
Owner SAMSUNG ELECTRONICS CO LTD
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