Packaging bracket and LED device

Abstract

The invention discloses a packaging bracket and an LED device. The packaging bracket comprises a first metal etching sheet which is provided with a chip placement layer and a first electrode arrangedin a stacked manner, wherein the long side of the chip placement layer is longer than the long side of the first electrode, and the short side of the chip placement layer is longer than the short sideof the first electrode; a second metal etching sheet provided with a connecting layer and a second electrode which are stacked, wherein the long side of the connecting layer is longer than the long side of the second electrode, and the short side of the connecting layer is longer than the short side of the second electrode. The first long side of the chip placement layer is flush with the end part of the first long side of the first electrode, and the connecting layer is flush with the end part of the first long side of the second electrode, so that a convex isolation groove is formed betweenthe first metal etching sheet and the second metal etching sheet; the first long side of the chip placement layer, the first long side of the connecting layer and all the short sides of the chip placement layer and the connecting layer are each provided with a connecting pin. By the adoption of the packaging bracket and the LED device, the problem of welding holes can be effectively solved.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a packaging bracket and an LED device. Background technique [0002] EMC (Epoxy molding compound, EMC for short) is very suitable for LED packaging devices due to its excellent properties such as high reliability, high thermal conductivity, high heat and humidity resistance, low stress, and low expansion coefficient. [0003] Such as figure 1 As shown, the package holder of the existing EMC package includes an etching sheet 1, an epoxy resin molding compound 2 and a connecting pin 3. The etching sheet 1 is usually fully etched into a first electrode 11 and a second electrode 12 separated from each other. The first electrode 11 It is insulated and isolated from the second electrode 12 and is used for setting LED chips and electrode leads, and the connecting pin 3 is used to connect the connecting pins of adjacent etched sheets, wherein the etched sheet 1 and the connecting pin 3 are...

AI Technical Summary

Problems solved by technology

However, due to the thicker thickness of the connecting pin, more copper scraps are likely to be generated during cutting, and the cutting surface of the connecting pin will be deformed under the action of the cutter to form a protrusion towards the surface of the electrode, which causes the LED device In the process of SMT (Surface Mount Technology, SMT for short), soldering voids are prone to appear, which makes the heat conduction effect of the electrode surface poor, thereby reducing the light extraction efficiency and service life of LED devices

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