Welding method of radiation unit
A welding method and technology for radiating units, which are applied in the direction of printed circuits connected with non-printed electrical components, electrical components, and assembling printed circuits with electrical components, can solve the problem that cross-PCB radiation units cannot be connected to tin by reflow soldering, and 5G antennas PCB radiation unit pad design size, shape, low efficiency of manual welding and other problems, to improve production efficiency and ensure quality
Active Publication Date: 2020-01-14
COMBA TELECOM TECH (GUANGZHOU) CO LTD
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Problems solved by technology
At present, the design size and shape of the pads of the 5G antenna PCB radiating unit are different. Such characteristics cause problems in the actual production process that the reflow soldering of the cross PCB radiating unit cannot be connected to tin, and the efficiency of manual soldering is low.
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[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0032] The present invention relates to a welding method of a radiation unit, please refer to figure 1 , which ensures the quality of solder joints by standardizing the PCB pad structure design process and the relationship between PCB dimensions, so as to solve the problem that the reflow soldering of cross PCB radiation units cannot be connected to tin. The production efficiency is high and the resulting radiation unit electric Stable performance.
[0033] The welding method of the radiation unit specifically includes the following ste...
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Abstract
The invention provides a welding method of a radiation unit, which solves the problem that tin cannot be plated on a radiation unit through reflow soldering, and comprises the following steps of: providing a radiation PCB, a power division PCB and a cross balun; forming slotted holes for insertion of the cross baluns in the corresponding positions of the radiation PCB and the power division PCB, and brushing solder paste on the two sides of the slotted holes in the two PCBs through a steel mesh to form first bonding pads; arranging second bonding pads on pins of the cross balun, and insertingthe pins of the cross balun into the corresponding slotted holes of the radiation PCB and the power division PCB; and performing preheating, reflow soldering and cooling fixation on the solder paste at the first bonding pads on the radiation PCB and the power division PCB through reflow soldering, so that the radiation PCB, the power division PCB and the cross balun are welded and fixed. By standardizing the design process of the bonding pad structure, effective connection between PCBs of the radiation unit is ensured, the quality of welding spots between vertical bonding pads is ensured, theproblem that tin cannot be plated on the radiation unit through reflow soldering is solved, and the production efficiency is effectively improved.
Description
technical field [0001] The invention relates to the technical field of antenna manufacturing, in particular to a welding method of a radiation unit. Background technique [0002] In base station antennas, PCB is widely used as the most basic connection device. First of all, the antenna radiation unit of the 5G base station needs to use PCB as the connection; secondly, the filter and other components of the 5G base station will increase significantly, and a separate PCB needs to be used to connect these components; finally, the CU / DU and other parts of the 5G base station also need Use PCBs. At present, the design size and shape of the pads of the 5G antenna PCB radiating unit are different. Such characteristics have caused problems in the actual production process that the reflow soldering of the cross PCB radiating unit cannot be connected to the tin, and the efficiency of manual soldering is low. Contents of the invention [0003] The object of the present invention is...
Claims
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IPC IPC(8): H05K3/34H05K1/18
CPCH05K1/184H05K3/3447H05K3/3494H05K2201/10007H05K2203/043
Inventor 龚奎马红智
Owner COMBA TELECOM TECH (GUANGZHOU) CO LTD