A welding method for radiation unit
A welding method and radiation unit technology, which is applied in the direction of printed circuits connected with non-printed electrical components, electrical components, and assembled printed circuits with electrical components, can solve the problem of reflow soldering of cross PCB radiation units that cannot be connected to tin and 5G antennas Solve problems such as different design sizes and shapes of PCB radiation unit pads, and low efficiency of manual soldering, so as to improve production efficiency and ensure quality
Active Publication Date: 2021-02-12
COMBA TELECOM TECH (GUANGZHOU) CO LTD
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Problems solved by technology
At present, the design size and shape of the pads of the 5G antenna PCB radiating unit are different. Such characteristics cause problems in the actual production process that the reflow soldering of the cross PCB radiating unit cannot be connected to tin, and the efficiency of manual soldering is low.
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[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0032] The present invention relates to a welding method of a radiation unit, please refer to figure 1 , which ensures the quality of solder joints by standardizing the PCB pad structure design process and the relationship between PCB dimensions, so as to solve the problem that the reflow soldering of cross PCB radiation units cannot be connected to tin. The production efficiency is high and the resulting radiation unit electric Stable performance.
[0033] The welding method of the radiation unit specifically includes the following ste...
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Abstract
The invention provides a welding method for a radiation unit, which solves the problem that reflow soldering cannot connect tin. The welding method for the radiation unit includes the following steps: providing a radiation PCB, a power dividing PCB and a cross balun; Open slots for the crossover baluns to be inserted in the corresponding positions of the PCB, and use the steel mesh to paint solder paste on both sides of the slots on the two PCBs to form the first pad; on the pins of the crossover baluns Set the second pad, and insert the pins of the cross balun into the corresponding slots of the radiation PCB and the power splitter; use reflow soldering to pass the solder paste at the first pad on the radiation PCB and the power splitter PCB in sequence Preheating, reflow soldering, cooling and fixing, so that the radiation PCB, power distribution PCB and cross balun are welded and fixed. By standardizing the design process of the pad structure, the effective connection between the PCBs of the radiation unit is ensured, the quality of the solder joints between the vertical pads is guaranteed, the problem that the radiation unit cannot be connected to tin by reflow soldering is solved, and the production efficiency is effectively improved.
Description
technical field [0001] The invention relates to the technical field of antenna manufacturing, in particular to a welding method of a radiation unit. Background technique [0002] In base station antennas, PCB is widely used as the most basic connection device. First of all, the antenna radiation unit of the 5G base station needs to use PCB as the connection; secondly, the filter and other components of the 5G base station will increase significantly, and a separate PCB needs to be used to connect these components; finally, the CU / DU and other parts of the 5G base station also need Use PCBs. At present, the design size and shape of the pads of the 5G antenna PCB radiating unit are different. Such characteristics have caused problems in the actual production process that the reflow soldering of the cross PCB radiating unit cannot be connected to the tin, and the efficiency of manual soldering is low. Contents of the invention [0003] The object of the present invention is...
Claims
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IPC IPC(8): H05K3/34H05K1/18
CPCH05K1/184H05K3/3447H05K3/3494H05K2201/10007H05K2203/043
Inventor 龚奎马红智
Owner COMBA TELECOM TECH (GUANGZHOU) CO LTD