Circuit board electroplating production equipment
A technology for production equipment and circuit boards, which is applied in the direction of electrical components, electrolytic process, electrolytic components, etc., can solve the problems that the uniform electroplating operation of circuit boards cannot be guaranteed, affects the efficiency of electroplating operations, and cannot be accurately controlled, so as to reduce the amount of electroplating , Improve the clamping applicability, improve the effect of the effect
Active Publication Date: 2021-02-26
惠州建富科技电子有限公司
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Problems solved by technology
Through the transmission mechanism, the circuit board enters from the feeding area and conveys it to the electroplating mechanism to complete the electroplating, and then completes the discharge through the discharge area to realize continuous electroplating of the circuit board; at the same time, the transmission speed of the transmission mechanism is controlled by the PLC controller and automatic control software and accurate automatic control of the electroplating process to realize automatic electroplating of circuit boards. Although the above-mentioned patent can solve the automatic electroplating operation of circuit boards, there are the following problems. On the one hand, uniform electroplating operations of circuit boards cannot be guaranteed during the electroplating process The electroplating operation of the circuit board is completed through the electroplating tank, and the accumulation and transition of the electroplating solution cannot be accurately controlled during the electroplating process. work efficiency
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[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0030]In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or It should not be construed as limiting the invention by implying that a referenced device or element must have a particular orientation, be ...
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The present invention relates to the technical field of circuit board processing equipment, in particular to circuit board electroplating production equipment, including a positioning carrying device, a circuit board conveying device and a positioning electroplating device, the circuit board conveying device is installed on the top of the positioning carrying device, and the positioning The output end of the electroplating device is docked with the transmission end of the circuit board transmission device. The circuit board transmission device includes two transmission parts symmetrically arranged on the positioning bearing device, and the transmission direction of each transmission part is perpendicular to the direction of the positioning electroplating device. Plating direction. On the one hand, the present invention can improve the working efficiency of the electroplating operation through two transmission parts to transmit the circuit board; Effect.
Description
technical field [0001] The invention relates to the technical field of circuit board processing equipment, in particular to circuit board electroplating production equipment. Background technique [0002] The circuit board is a circuit board that can connect circuits to facilitate the performance of each component. The circuit board is based on an insulating board, cut to a certain size, with at least one conductive pattern attached to it, and holes (such as component holes, fastening holes, metallized holes, etc.), used to replace the electronic components of the previous installation Chassis, and realize the interconnection between electronic components. [0003] The production process of the circuit board involves blanking and edging, drilling, outer layer graphics, gold plating, etching, inspection, silk screen solder mask, hot air leveling, silk screen characters, shape processing and testing inspection. In the above process, various techniques must be used to protect...
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IPC IPC(8): C25D17/28C25D5/08H05K3/18
CPCC25D5/08C25D17/28H05K3/188
Inventor 温锦光
Owner 惠州建富科技电子有限公司