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Flexible circuit board

A flexible circuit board and circuit area technology, applied in circuit thermal devices, printed circuit parts, circuit bendable/stretchable parts, etc. Support strength, improve heat dissipation, improve the effect of bonding interface

Pending Publication Date: 2020-01-17
JADE BIRD DISPLAY SHANGHAI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the chip is packaged with the flexible circuit board, due to the soft and bendable characteristics of the flexible circuit board, the chip does not have a stable substrate for packaging. Often after packaging, there are many air gaps between the chip and the flexible circuit board, which will cause the chip The package is not firm, and it is easy to fall off, which leads to the failure of the entire package structure
[0003] In addition, light-emitting chips generate a lot of heat, but the heat dissipation will be blocked between the chip and the flexible circuit board, resulting in heat accumulation and reducing the service life and performance of the final energy product

Method used

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Embodiment Construction

[0031] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0032] The following is attached Figure 1-7 The present invention will be described in further detail with specific examples. It should be noted that the drawings are all in a very simplified form, using imprecise scales, and are only used to facilitate and clearly achieve the purpose of assisting in describing the present embodiment.

[0033] see figure 1 with 2 , a flexible chip packaging structure of this embodiment, comprising

[0034] FPC 00;

[0035] A ceramic reinforcing sheet 02, arranged on the back of the flexible circuit board 00;

[0036] A chip ...

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Abstract

The invention provides a flexible circuit board. The circuit connection area and the non-functional area adjacent to the circuit connection area are arranged on the flexible circuit board, so that thecombination of a chip and the circuit connection area is realized. Furthermore, a hollow area is arranged in the non-functional area; therefore, one part of the chip can cover the hollow area, thereby improving heat dissipation of the chip, moreover, a reinforcing sheet is arranged on the back surface of the non-functional area; good support strength and a flat surface are provided for the combination of the chip and the flexible circuit board, the combination capability of the chip and the flexible circuit board is improved, the combination interface of the chip and the flexible circuit board is improved, the heat dissipation capability of the chip is also improved, and the corrosion resistance of the combination interface of the flexible circuit board and the chip is also improved. Dueto the design of the hollow area of the non-functional area, the reinforcing sheet can be in direct contact with the chip to improve the heat dissipation capability, thereby prolonging the service life of the chip on the flexible circuit board and improving the performance of the whole device.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a flexible circuit board. Background technique [0002] Flexible printed circuit (FPC) breaks through the traditional interconnection technology and is favored for its light weight, thin thickness, free bending and folding and other excellent characteristics. When the chip is packaged with the flexible circuit board, due to the soft and bendable characteristics of the flexible circuit board, the chip does not have a stable substrate for packaging. Often after packaging, there are many air gaps between the chip and the flexible circuit board, which will cause the chip The packaging is not firm, and problems such as easy to fall off occur, resulting in failure of the entire packaging structure. [0003] In addition, light-emitting chips generate a lot of heat, but the heat dissipation will be blocked between the chip and the flexible circuit board, resulting in heat accumulation...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0203H05K1/0209H05K1/0281
Inventor 章帅琚晶李起鸣
Owner JADE BIRD DISPLAY SHANGHAI LTD
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