Radiating device and method and cabinet

A technology of heat dissipation device and heat dissipation method, which is applied in cooling/ventilation/heating transformation, electrical equipment shell/cabinet/drawer, electrical components, etc., to solve the problem of heat dissipation power consumption and effect, and improve the effect of heat dissipation

Inactive Publication Date: 2015-05-20
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the main purpose of the present invention is a heat dissipation device, a hea

Method used

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  • Radiating device and method and cabinet
  • Radiating device and method and cabinet
  • Radiating device and method and cabinet

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Example one

[0035] The cold air is sucked in from the front panel 1011 of the subrack and drawn out from the rear panel 1012 of the subrack. The front insert single board 301 and the rear insert single board 302 are connected to the backplane 200 through connectors. The design of the backplane 200 is different from the traditional backplane design. The width of the backplane is very narrow to maximize the wind direction of the main air duct. The heat of the front board 301 can be quickly extracted, which facilitates heat dissipation of the chassis.

[0036] Attached Figure 3a to 3d This is a specific embodiment of the present invention.

[0037] Such as Figure 3a As shown, the front insert single board 301 and the rear insert single board 302 are placed in parallel inside the subrack 101. Attached Figure 3b As shown, the rear insert boards 302 are respectively located on the left and right sides of the insert box 101, and the fan unit 501 is located in the middle of th...

Example Embodiment

[0040] Example two

[0041] Attached Figure 4a-4d This is a specific embodiment of the present invention.

[0042] Attached Figure 4a , 4b As shown, the front-insertion veneer 301 and the rear-insertion veneer 302 are vertically placed inside the subrack 101, and the back board 200 is placed in the lower part of the subrack 101, close to the lower surface of the subrack 101. The slot direction of the rear board 302 is parallel to the horizontal panel direction of the plug-in box.

[0043] Attached Figure 4c with 4d As shown, the cold air is drawn in from the air inlet 701 on the front panel of the front board 301, and is directly drawn out by the fan unit 501 after passing through the front board 301. The rear-insertion veneer windshield 122 and the subrack panel form a rear-insertion veneer heat dissipation air duct. The air inlet 601 is located at the bottom of the subrack 101; the air inlet 611 is located on the left and right sides of the subrack 101, and is scattered on th...

Example Embodiment

[0044] Example three

[0045] Attached Figure 5a with 5b This is a specific embodiment of the present invention. Compared with the second embodiment, the difference is that the circuit board 312 of the rear-inserted single board 302 is retracted inward, and the cold air drawn in from the air inlet 601 can enter the mixed air zone 102 through the upper and lower surfaces of the circuit board 312, and then the fan The unit 501 draws out the hot air to improve the heat dissipation effect of the rear board 302.

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PUM

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Abstract

The invention discloses a radiating device and method and a cabinet. The radiating device comprises a plug box, a back plate, a front plug single plate, a rear plug single plate and a fan unit. The back plate, the front and the rear plug single plates and the fan unit are arranged in the plug box. The plug box comprises a horizontal face plate, a vertical face plate and a front and a rear face plates. At least one air inlet is formed in the rear portion of the horizontal face plate and/or a place, close to the rear plug single plate, of the vertical face plate. A cooling air channel is formed by combining the horizontal face plate, the vertical face plate and the rear plug single plate and passes the surface of the rear plug single plate, accordingly allowing cooling airflow, under action of the fan unit, to pass the surface of the rear plug single plate through the air inlets and then be discharged out of the plug box.

Description

technical field [0001] The present invention relates to the technical fields of communication and IT servers, in particular to a heat dissipation device, a heat dissipation method and a cabinet. Background technique [0002] The explosive growth of large-capacity data storage requirements has brought many challenges to communication and IT server equipment: system integration and power consumption continue to increase, and heat dissipation is facing many challenges; high-bandwidth data exchange technology is facing huge challenges. [0003] A traditional subrack system usually includes a front board, a backplane, a rear board, a management control unit, a fan unit, and a power module. Various functional modules are connected together indirectly or directly through the backplane to form a complete system. As an important part of the system, the backplane realizes functions such as power distribution, clock distribution, management and control signal distribution, and data ex...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K5/00
Inventor 刘奎赵闪王爱东
Owner ZTE CORP
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