Preparation method of shell, shell and electronic equipment

Abstract

The invention provides a preparation method of a shell, the shell and electronic equipment. The preparation method of the shell comprises the steps that a metal shell and a metal heat conduction pieceare provided; an accommodating space similar to the metal heat conduction piece in shape is formed in the metal shell; the metal heat conduction piece is placed in the accommodating space, and the metal heat conduction piece and the metal shell are welded together; and the material protruding out of the outer surface of the metal shell at the position of the accommodating space is removed so as to enable the outer surface of the metal shell to be smooth. The invention provides the preparation method of the shell, the shell and electronic equipment, which are suitable for ultrathin electronicproducts and have high reliability in high-temperature operation.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a method for preparing a housing, the housing and electronic equipment. Background technique [0002] In recent years, intelligent electronic equipment has made remarkable progress. The high heat generating components in the equipment, such as central processing unit CPU, graphics processing unit GPU, etc., while obtaining higher clock frequency, the heat generation has also increased a lot. The air cooling method that completely relies on traditional heat sinks in electronic equipment can no longer meet the heat dissipation requirements of electronic equipment. Therefore, there has been a solution to use metal heat conducting parts to export heat to the metal shell of the product to increase the heat dissipation area. [0003] In related technologies, the method of using metal heat conduction parts to export heat to the metal shell of the product is to pas...

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Problems solved by technology

[0004] The above-mentioned related technologies have already encountered technical bottlenecks in the face of ultra-thin electronic products such as mobile phones, tablets, and notebooks, which will directly cause the accumulation of product thickness and affect the overall aesthetics of electronic products; at the same time, long-term high-temperature operation of electronic products will cause plastic surface There is a problem of ungluing when heated, which destroys the structure of electronic products and affects the thermal conductivity

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