Thermal analysis device, thermal analysis method, and thermal analysis program

Abstract

To reduce time required for thermal analysis, an estimation model generation and output unit refers to a contact determination model DB, in which a contact determination model obtained from past design resources is stored, estimates the presence / absence of contact of each of a component pair included in a target product and generates an estimation model table (S20). A division number determinationunit refers to a division method DB, in which the relation between parameters (Sr, Tr) related to heat transfer of two components and a division number in a thermal circuit network model is stored, and determines a division number in a thermal circuit network model of the component pair included in the target product (S28). A thermal circuit network model analysis unit uses a contact determination table, which is a corrected estimation model table, and the division number determined by the division number determination unit to construct a thermal circuit network model of the target product, and executes thermal analysis (S30).

Description

technical field [0001] The invention relates to a thermal analysis device, a thermal analysis method and a thermal analysis program. Background technique [0002] Conventionally, in thermal analysis of a printed circuit board on which a heat-generating component is mounted, an expert or the like creates a model and performs thermal analysis each time according to the analysis purpose and analysis accuracy. However, knowledge of model creation is required and rapid thermal analysis cannot be performed. Therefore, in recent years, researches on techniques for automatically constructing models have been conducted (for example, refer to Patent Documents 1 to 3, etc.). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2004-318250 [0006] Patent Document 2: Japanese Patent Laid-Open No. 2007-122506 [0007] Patent Document 3: Japanese Patent Laid-Open No. 2012-64036 Contents of the invention [0008] The probl...

AI Technical Summary

Problems solved by technology

However, knowledge of model generation is required, and rapid thermal analysis cannot be performed. Therefore, in recent years, research on techniques for automatically constructing models has been conducted (for example, refer to Patent Documents 1 to 3, etc.)

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