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A method for forming a magnesium alloy hollow four-layer structure

A layer structure, magnesium alloy technology, applied in forming tools, metal processing equipment, manufacturing tools, etc., can solve the problems of easy oxidation of the surface, difficult to eliminate, high activity of magnesium alloys, etc., to improve forming efficiency, reduce production costs, increase Effect of contact area

Active Publication Date: 2020-12-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems that the existing magnesium alloy has high activity, the surface is easy to oxidize and is difficult to eliminate, the diffusion connection performance of the magnesium alloy is poor, and the hollow structure is difficult to realize, and to provide an integrated forming of the hollow four-layer structure of the magnesium alloy method

Method used

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  • A method for forming a magnesium alloy hollow four-layer structure
  • A method for forming a magnesium alloy hollow four-layer structure
  • A method for forming a magnesium alloy hollow four-layer structure

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Experimental program
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specific Embodiment approach 1

[0032] Specific implementation mode 1: This implementation mode is an integrated forming method of low-temperature forming / high-temperature reaction-diffusion connection of a magnesium alloy hollow four-layer structure, which is completed according to the following steps:

[0033] 1. Pretreatment:

[0034] Remove the oil and scale on the surface of the magnesium plate, and then clean the copper foil to obtain a pretreated magnesium plate and a pretreated copper foil;

[0035] 2. Preparation of core board:

[0036] First, spray 3mm~5mm peelable adhesive on one surface of the pretreated magnesium board, and then fix the peeling board on the surface of the magnesium board sprayed with peelable adhesive. The surface of the magnesium board sprayed with peelable adhesive is not covered with the peeling board. The area is the solder resist area, then remove the peelable adhesive at the solder resist area, remove the peeling plate, and then spray the release agent solution on the sol...

specific Embodiment approach 2

[0054] Embodiment 2: The difference between this embodiment and Embodiment 1 is that in step 2, a peelable adhesive of 3 mm to 5 mm is first sprayed on one surface of the pretreated magnesium plate. Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0055] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that in step one, silicon carbide sandpaper 180#, silicon carbide sandpaper 400#, silicon carbide sandpaper 800#, metallographic sandpaper 400# and Grind the surface of the magnesium plate with metallographic sandpaper 800# until the surface of the magnesium plate is bright, and then ultrasonically clean the magnesium plate in acetone for 5 minutes to 10 minutes to remove the oil and scale on the surface of the magnesium plate to obtain a pretreated magnesium plate. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses an integrated forming method for low-temperature forming / high-temperature reaction diffusion bonding for a hollow four-layer structure of a magnesium alloy, and relates to a diffusion bonding method for a magnesium alloy. The invention aims at solving the problems that an existing magnesium alloy is high in activity, the surface is liable to be oxidized and difficultly eliminated, the magnesium alloy is low in diffusion bonding performance, and a hollow structure is difficultly realized. The method comprises the following steps: 1, carrying out pretreatment; 2, preparing core plates; 3, stacking plates; 4, carrying out superplastic forming on surface plates; 5, carrying out diffusion bonding on the core plates; 6, carrying out superplastic forming on the core plates; 7, carrying out diffusion bonding on the surface plates and the core plates; and 8, carrying out die release to obtain a formed part. The method realizes integrated forming, that is, completes the two procedures of forming and connection in one period, so that the forming efficiency is increased, and the production cost is reduced; and the part prepared through the method is not broken from a welding joint, and the shear strength of the part is capable of achieving 98% and above of the shear strength of base metal. The method is applicable to diffusion bonding for the magnesium alloy.

Description

technical field [0001] The invention relates to a magnesium alloy diffusion connection method. Background technique [0002] Lightweight structure, as one of the important ways to save materials, save fuel, reduce pollutant emissions and improve maneuverability, has been widely used in automobiles, airplanes, rockets and other means of transportation, especially in the aerospace field, every 1kg of weight loss is economical. The benefit is very significant, and the hollow structure largely meets the lightweight requirements. At present, due to its excellent mechanical properties, titanium alloys are widely used in superplastic forming / diffusion bonding, and rare earth magnesium alloys are compared with titanium alloys. , lower density, higher strength, and its hollow structure will further meet the requirements of lightweight, but the difficulty of diffusion bonding of magnesium alloys is that the material is highly active, and the surface is easy to oxidize and difficult to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D26/055B21D26/059B21D26/021B21D26/027B21D37/16B21D39/03
CPCB21D26/021B21D26/027B21D26/055B21D26/059B21D37/16B21D39/038
Inventor 蒋少松胡蓝彭鹏卢振
Owner HARBIN INST OF TECH
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