Mold with semiconductor refrigeration devices
A refrigeration device and semiconductor technology, which is applied in the direction of refrigerators, refrigeration and liquefaction, and the operation mode of machines. It can solve the problems of large structure and large occupied area, achieve flexible installation, small occupied area, and reduce the influence of mold cavity. Effect
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[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0022] see Figure 1-Figure 4 , a mold with a semiconductor refrigeration device, comprising a template 1, more than one semiconductor refrigeration device is connected to the outside of the template 1, the semiconductor refrigeration device includes a cold guide block 2, a semiconductor refrigeration chip 3, and the semiconductor refrigeration chip 3 is provided with a heat-absorbing surface 3.1 and the heat-releasing surface 3.2; wherein, one side of the cooling block 2 is closely attached to the outer surface of the template 1, and the other side of the cooling block 2 is closely attached to the heat-absorbing surface 3.1 of the semiconductor refrigeration chip 3, so as to be in the external air Release the heat.
[0023] The mold cavity corresponding to the template 1 is provided with a cooling water pipe, the cooling block 2 is closely attached to...
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