Mold with semiconductor refrigeration devices

A refrigeration device and semiconductor technology, which is applied in the direction of refrigerators, refrigeration and liquefaction, and the operation mode of machines. It can solve the problems of large structure and large occupied area, achieve flexible installation, small occupied area, and reduce the influence of mold cavity. Effect

Pending Publication Date: 2020-02-07
GUANGDONG SUNWILL PRECISING PLASITC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The structure is huge and occupies a large area, so it needs further improvement

Method used

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  • Mold with semiconductor refrigeration devices
  • Mold with semiconductor refrigeration devices
  • Mold with semiconductor refrigeration devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0022] see Figure 1-Figure 4 , a mold with a semiconductor refrigeration device, comprising a template 1, more than one semiconductor refrigeration device is connected to the outside of the template 1, the semiconductor refrigeration device includes a cold guide block 2, a semiconductor refrigeration chip 3, and the semiconductor refrigeration chip 3 is provided with a heat-absorbing surface 3.1 and the heat-releasing surface 3.2; wherein, one side of the cooling block 2 is closely attached to the outer surface of the template 1, and the other side of the cooling block 2 is closely attached to the heat-absorbing surface 3.1 of the semiconductor refrigeration chip 3, so as to be in the external air Release the heat.

[0023] The mold cavity corresponding to the template 1 is provided with a cooling water pipe, the cooling block 2 is closely attached to...

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PUM

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Abstract

The invention provides a mold with semiconductor refrigeration devices. The mold comprises a mold plate. One or more semiconductor refrigeration devices are connected to the outer side of the mold plate. Each semiconductor refrigeration device comprises a cold conduction block and a semiconductor refrigeration chip. Each semiconductor refrigeration chip is provided with a heat absorbing face and aheat releasing face. One side of each cold conduction block is tightly attached to the outer surface of the mold plate, and the other side of each cold conduction block is tightly attached to the heat absorbing face of the corresponding semiconductor refrigeration chip. The heat releasing faces communicate with air in the outside world. A cooling water pipe is arranged on the portion, corresponding to a mold cavity, in the mold plate. The cold conduction blocks are tightly attached to the outer surface of the mold plate, and the cold conduction blocks on the outer surface of the mold plate are close to the cooling water pipe. According to the mold, one or more semiconductor refrigeration devices are connected to the outer side of the mold plate, and while the internal structure of the mold is not changed, refrigeration is effectively conducted on the mold, the mold water transportation effect is improved, influences of the mold cavity are reduced and the injection molding quality is improved.

Description

technical field [0001] The invention relates to a mold with a semiconductor refrigeration device. Background technique [0002] The product and the mold belong to a closed system, and the heat dissipation method of the mold is as follows: the heat of the product can only be taken away by the mold. The heat Q brought into the mold by the traditional mold plastic is taken away by four parts. Q=Qf+Qd+Qc+Qw, where Qf is radiation heat dissipation, which is affected by mold surface area, ambient temperature and radiation heat dissipation coefficient; Qd is convection heat dissipation, which is affected by convection heat transfer coefficient, mold side surface area, mold cavity and distribution Influenced by the surface area of ​​the molding surface; Qc is the heat dissipation from the mold to the injection machine template, which is affected by the conduction heat dissipation coefficient, the contact area between the mold and the injection molding machine plate, and the tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/73F25B21/02
CPCB29C45/73F25B21/02
Inventor 罗嘉豪王法征覃万翔乐柱全
Owner GUANGDONG SUNWILL PRECISING PLASITC CO LTD
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