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A power amplifier module cooling device and radar

A power amplifier module and heat sink technology, which is applied in cooling/ventilation/heating transformation, modification using liquid cooling, electrical components, etc., can solve the problems of limited effect, inability to meet the heat dissipation requirements of high-power amplifier modules, and poor temperature uniformity, etc. Achieve the effect of increasing the contact area, ensuring the heat dissipation demand, and improving the thermal conductivity

Active Publication Date: 2020-11-03
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This heat dissipation method has limited effect and poor temperature uniformity, and cannot meet the heat dissipation requirements of high-power power amplifier modules.

Method used

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  • A power amplifier module cooling device and radar
  • A power amplifier module cooling device and radar
  • A power amplifier module cooling device and radar

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Such as Figure 1-3 As shown, a power amplifier module cooling device includes a heat conduction device and a radiator, and the heat conduction device is fixedly connected to the radiator; the heat conduction device is provided with an accommodation chamber for accommodating the power amplifier module 4, or the heat conduction device and the radiator are surrounded by a An accommodating cavity for accommodating the power amplifier module 4 .

[0033] When the present invention works, the heat emitted by the power amplifier module 4 in the accommodating cavity is transferred to the radiator through the heat conduction device, and then dissipates heat through the radiator; when the power amplifier module 4 is inserted into the accommodating cavity, the distance between the power amplifier module 4 and the heat conduction device is increased. The contact area improves the heat conduction capacity from the power amplifier module 4 to the radiator, enhances its heat dissipat...

Embodiment 2

[0057] A radar includes a power amplifier module 4 and the above heat dissipation device for the power amplifier module, and the power amplifier module 4 is inserted into an accommodation cavity.

[0058] The beneficial effects of this embodiment are: this embodiment has all the beneficial effects of the above-mentioned embodiment 1, and will not be repeated here.

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Abstract

The invention relates to a power amplifier module heat dissipation device and radar. The power amplifier module heat dissipation device comprises a heat conduction device and a radiator, and the heatconduction device is fixedly connected with the radiator; the heat conduction device is internally provided with an accommodating cavity used for accommodating a power amplifier module, or the accommodating cavity used for accommodating the power amplifier module is formed by the heat conduction device and the radiator in an enclosing mode. When the power amplifier module heat dissipation device works, the heat emitted by the power amplifier module in the accommodating cavity is transmitted to the radiator by heat conduction by the heat conduction device, and is radiated by the radiator; and when the power amplifier module is inserted into the accommodating cavity, the contact area of the power amplifier module and the heat conduction device is increased, the heat conduction capacity fromthe power amplifier module to the radiator is improved, the heat radiation effect of the power amplifier module is enhanced, and the heat radiation requirement of the high-power power amplifier moduleis ensured.

Description

technical field [0001] The invention relates to the field of cooling devices, in particular to a cooling device for a power amplifier module and a radar. Background technique [0002] Power amplifier modules are widely used in radar, communication and other fields to achieve microwave signal power enhancement. The power amplifier module will emit heat when it is working, and it needs to be dissipated to ensure its normal temperature and normal operation. Existing power amplifier modules generally rely on copper shells to connect to radiators to force convection to dissipate heat outward. This heat dissipation method has limited effects and poor temperature uniformity, and cannot meet the heat dissipation requirements of high-power power amplifier modules. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a power amplifier module cooling device and radar to solve at least one of the above technical problems. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20172H05K7/2029H05K7/20436
Inventor 廖全文刘晓红李培培陈彦
Owner BEIJING INST OF RADIO MEASUREMENT
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