Heat dissipation structure and method for manufacturing same
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SZ DJI TECH CO LTD
- Publication Date
- 2020-02-07
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Abstract
Description
technical field
[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation structure and a method for manufacturing the heat dissipation structure. Background technique
[0002] In the existing heat dissipation structure, a magnetic conductive member is often provided to limit the position of the rotor of the heat dissipation structure when it stops, so as to activate the rotor when starting. In the existing heat dissipation structure, the magnetic conductive part is usually made as a whole with the bottom plate of the heat dissipation structure. The process is usually to use a mold for one-time molding, that is, first set a groove for the magnetic conductive part on the mold, and put the magnetic conductive part into the In the groove, make the bottom plate again. This process has the following problems: due to the small size of the magnetic parts, it is inconvenient to manually place them into the groove of the m...