Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Eutectic soldering device and application thereof

A technology of eutectic welding and gas nozzle, applied in auxiliary devices, welding equipment, electrical components, etc., can solve problems such as oxidation, lack of gas protection devices, and affecting eutectic effects

Active Publication Date: 2020-02-11
INST OF ELECTRONICS CHINESE ACAD OF SCI
View PDF11 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the small eutectic welding hot stations are simple in structure and only have a single hot station, lacking a gas protection device. During the eutectic welding process, the solder is easily exposed to the air, causing oxidation and ultimately affecting the eutectic effect.
Therefore, the cost of eutectic furnace is high, it is not suitable for eutectic welding of small-scale chips, and the traditional hot stage suitable for eutectic welding of small-scale chips lacks gas protection devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Eutectic soldering device and application thereof
  • Eutectic soldering device and application thereof
  • Eutectic soldering device and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0041] In an embodiment of the present invention, a hot stage and a gas protection device suitable for chip eutectic welding are provided, such as figure 1 As shown, the device includes a heating stage for eutectic welding, and the heating stage 1 has a temperature adjustment knob 11 and a gas flow knob 12 for adjusting temperature and gas flow. There is a layer of heat insulating pad 13 on the upper surface of the heating stage 1, the material of the heat insulating pad 13 is polyimide, the middle part of the heat insulating pad 13 is a cuboid, and the cuboid is the eutectic region 14 of the chip. A hot stage air outlet is left on the top of the hot stage 1 .

[0042] Such as figure 2 with 3 As shown, a hot stage and gas protection device suitable for chip eutectic soldering includes a gas shower head 2 with an array of exhaust holes 22 . The gas shower head 2 is placed above the hot stage 1 , and the inert gas or nitrogen gas is discharged through the exhaust hole 22 to ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a eutectic soldering device and application thereof. The eutectic soldering device includes a heating stage, a gas spray nozzle and a support frame, wherein a eutectic working zone is arranged on the upper surface of the heating stage; the gas spray nozzle is arranged above the eutectic working zone, and gas vents are formed in the gas spray nozzle, face to the eutectic working zone, and are used for blowing a shielding gas to the eutectic working zone; the support frame is arranged between the gas spray nozzle and the heating stage, and is used for fixedly connecting the gas spray nozzle with the heating stage; wherein a through cavity is formed inside the support frame, and is communicated with the gas spray nozzle, so as to form a route for conveying the shieldinggas to the gas spray nozzle. According to the invention, the design that the heating stage is equipped with the gas spray nozzle is provided, so that the eutectic working zone is blown to achieve theeffect of gas shielding, and oxidation of welding flux caused by contact with air is avoided; and the eutectic soldering device is applicable to eutectic soldering of small-scale chips, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of chip eutectic welding, in particular to a eutectic welding device and its application. Background technique [0002] Eutectic welding, also known as low melting point alloy welding, is a commonly used welding technology in the field of chip welding, and is widely used in the field of electronic packaging. The current "vacuum, controlled atmosphere eutectic furnace" can achieve eutectic without using flux, and has the function of vacuuming and filling inert gas, which is suitable for large-scale eutectic welding. At present, most of the small eutectic welding hot stations are simple in structure and only have a single hot station, lacking gas protection devices. During the eutectic welding process, the solder is easily exposed to air, causing oxidation, and ultimately affecting the eutectic effect. Therefore, the cost of the eutectic furnace is high, and it is not suitable for eutectic welding of small-scale chips,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K3/08H01L21/60
CPCB23K1/008B23K3/08H01L24/75H01L2224/751
Inventor 王毅王松史戈张海波杨涛李中喻忠军徐正刘骁
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com