Package
A package and plastic package technology, which is applied in circuit devices, transportation and packaging, electric solid devices, etc., can solve problems such as chips not working properly
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[0022] In order for those skilled in the art to better understand the technical solution of the present application, a package provided by the invention will be further described in detail below with reference to the drawings and specific embodiments.
[0023] This application presents a package, please refer to figure 1 , figure 1 It is a structural schematic diagram of an embodiment of the package body of the present application. The package 100 in this embodiment includes a chip 11 , a plurality of metal substrates 12 , a plastic package 13 and a protection element 14 .
[0024] The chip 11 may include a plurality of chip pins, wherein the plurality of chip pins may include a ground chip pin GND and a power chip pin VDD. The chip 11 in this application may be any type of chip, such as a control chip, a protection chip, etc., which is not limited here.
[0025] For example, the chip 11 may be a protection chip for protecting the charging and discharging process of the lit...
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