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Package

A package and plastic package technology, which is applied in circuit devices, transportation and packaging, electric solid devices, etc., can solve problems such as chips not working properly

Active Publication Date: 2022-01-04
SHENZHEN WINSEMI MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present application provides a package body to solve the problem that the chip may not work normally in the prior art

Method used

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Embodiment Construction

[0022] In order for those skilled in the art to better understand the technical solution of the present application, a package provided by the invention will be further described in detail below with reference to the drawings and specific embodiments.

[0023] This application presents a package, please refer to figure 1 , figure 1 It is a structural schematic diagram of an embodiment of the package body of the present application. The package 100 in this embodiment includes a chip 11 , a plurality of metal substrates 12 , a plastic package 13 and a protection element 14 .

[0024] The chip 11 may include a plurality of chip pins, wherein the plurality of chip pins may include a ground chip pin GND and a power chip pin VDD. The chip 11 in this application may be any type of chip, such as a control chip, a protection chip, etc., which is not limited here.

[0025] For example, the chip 11 may be a protection chip for protecting the charging and discharging process of the lit...

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PUM

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Abstract

The application discloses a package body, including a chip, which includes a plurality of chip pins, wherein the plurality of chip pins include ground chip pins and power chip pins; a plurality of metal substrates, wherein the chips are placed on multiple On at least one of the metal substrates; the plastic package is used for encapsulating the chip and the plurality of metal substrates, and exposing parts of the plurality of metal substrates so that the exposed parts of the plurality of metal substrates As the package pins of the package, the package pins include the ground package pins and the power package pins; the protection element is arranged in the plastic package and connected to the ground package pins of the package, the power package between the body pin and the ground chip pin of the chip, and the power chip pin to protect the power supply connected to the chip and the package. In the present application, a protection element is provided in the packaging body, which can ensure the normal operation of the chip and the battery in the case of reverse connection of the battery, instantaneous high current of the battery or short circuit.

Description

technical field [0001] The present application relates to the technical field of electronic devices, in particular to a packaging body. Background technique [0002] With the increasing popularity of portable electronic devices such as mobile phones, notebooks, and smart toys, such products are generally powered by batteries, such as lithium batteries. However, lithium batteries have many safety problems, so lithium batteries need a lithium battery protection system to increase safety and reliability. While more and more battery manufacturers are pursuing the reliability of battery protection, they are also considering reducing system costs. [0003] At present, the lithium battery protection system is generally made in the form of a chip. However, due to some problems in the charging and discharging process of the lithium battery, such as the instantaneous high current or short circuit of the battery, the chip of the lithium battery protection system cannot work normally. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L23/31H02J7/00
CPCH01L25/16H01L23/3107H02J7/0029H02J7/0034H01L2224/48257H01L2924/19105H01L2224/48247
Inventor 宋利军宋朋亮肖春兰陈俊梅
Owner SHENZHEN WINSEMI MICROELECTRONICS