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Camera module and electronic equipment

A technology of camera module and lens module, which is applied in branch office equipment, television, telephone communication, etc., to improve user experience and improve shooting effect

Active Publication Date: 2020-02-11
VIVO MOBILE COMM HANGZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, embodiments of the present invention provide a camera module and electronic equipment to solve the problem that the angle between the infrared filter and the photosensitive chip affects the definition of the camera module.

Method used

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  • Camera module and electronic equipment
  • Camera module and electronic equipment
  • Camera module and electronic equipment

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] figure 2 It is a schematic diagram of a camera module provided by an embodiment of the present invention. Such as figure 2 As shown, the camera module includes a lens module 11 , an infrared filter 12 , a base 13 , a photosensitive chip 14 , a circuit board 15 and an angle adjustment assembly 16 .

[0032] The lens module 11 is disposed on the base 13 , the base 13 is disposed on the first surface of the circuit board 15 , the photosens...

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Abstract

The embodiment of the invention provides a camera module, and belongs to the technical field of electronic equipment. When the camera module provided by the invention is used, the lens module is arranged on the base. The base is arranged on the first surface of the circuit board; a photosensitive chip is arranged on the first surface of the circuit board; the light receiving surface of the photosensitive chip faces the lens module; a boss is arranged on the inner wall of the base; an angle adjusting assembly is arranged on the boss, an infrared optical filter is arranged on the angle adjustingassembly, the infrared optical filter is located between the lens module and the photosensitive chip, the circuit board is electrically connected with the angle adjusting assembly, and therefore after light penetrates through the lens module, the light continues to penetrate through the infrared optical filter, and then the light is converted into an image by the photosensitive chip. When an included angle exists between the infrared optical filter and the photosensitive chip, power can be supplied to the angle adjusting assembly through the circuit board, so that the angle adjusting assemblydeforms, and the included angle between the infrared optical filter and the photosensitive chip can be smaller than a preset value.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a camera module and electronic equipment. Background technique [0002] With the continuous development of technology, electronic devices have become tools that people use every day. In the process of using an electronic device to take pictures, it is necessary to install a camera module in the electronic device, and the camera module is used for taking pictures. [0003] related technologies, such as figure 1 As shown, the camera module includes a lens module 11 , an IR film (infrared filter, infrared filter) 12 , a holder (base) 13 , a sensor (photosensitive chip) 14 and a circuit board 15 . The lens module 11 is fixed on the base 13 by AA (Active Alignment, Active Alignment) process glue dispensing, the base 13 is arranged on the first surface of the circuit board 15, and the photosensitive chip 14 is arranged on the first surface of the circuit board 15 , and ...

Claims

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Application Information

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IPC IPC(8): H04N5/225H04M1/02
CPCH04M1/0264H04N23/57H04N23/55H04N23/54
Inventor 陈宇灏
Owner VIVO MOBILE COMM HANGZHOU CO LTD
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