Vacuum furnace equipment for reflow soldering machine

A technology of reflow soldering machine and vacuum furnace, which is applied in the direction of welding equipment, metal processing equipment, electric heating device, etc., can solve the problems of PCB circuit board stroke error, chain friction coefficient reduction, chain and PCB circuit board friction reduction, etc. Achieve the effects of promoting temperature, accurate stroke control, and preventing feeding errors

Pending Publication Date: 2020-02-14
东莞市健时自动化设备有限公司
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Problems solved by technology

[0003] But the existing vacuum furnace has many deficiencies, for example: in the existing reflow soldering machine, the PCB circuit board needs to be preheated before being sent into the vacuum furnace by the furnace conveying assembly, but at a higher temperature, it is easy to Insufficient friction between the furnace conveying component and the PCB circuit board occurs, such as the board introducing device of the reflow soldering machine disclosed in a patent for the furnace conveying component (patent application number 200820046891.4) that the applicant applied for before the filing date , in an ultra-high temperature state, the friction coefficient of the chain will decrease, resulting in a decrease in the friction between the chain and the PCB circuit board, and finally the problem that the stroke of the PCB circuit board is wrong

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  • Vacuum furnace equipment for reflow soldering machine
  • Vacuum furnace equipment for reflow soldering machine
  • Vacuum furnace equipment for reflow soldering machine

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Embodiment

[0029] A vacuum furnace equipment for a reflow soldering machine, comprising a frame 1, a lower furnace body 2, an upper furnace body 3 and a furnace feeding assembly 4, the two ends of the frame 1 are respectively provided with the lower furnace body 2 and the furnace-in transfer assembly 4; it also includes a furnace-input material picking assembly 5, an upper furnace body jacking assembly 6 and an upper furnace body heating assembly 7.

[0030]The furnace-input material pulling assembly 5 cooperates with the furnace-entry transmission assembly 4, and includes a linear module 8, a first base 9, a first motor 10, a vertical plate 51, a fifth synchronous wheel 52, and a sixth synchronous wheel 53 , the third synchronous belt 54 and the material rod 11; the linear module 8 is fixed on the frame 1, and the linear module 8 drives the first base 9 along the feeding direction of the furnace conveying assembly 4 reciprocating movement; the first base 9 is provided with the first mot...

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Abstract

A vacuum furnace equipment for a reflow soldering machine comprises a rack (1), a lower furnace body (2), an upper furnace body (3) and a furnace entering conveying assembly (4), wherein the two endsof the rack (1) are provided with the lower furnace body (2) and the furnace entering conveying assembly (4) which are matched with each other respectively. The vacuum furnace equipment further comprises a furnace inlet poking assembly (5), an upper furnace body jacking assembly (6) and an upper furnace body heating assembly (7); and a plurality of grids (19) are arranged on the outer wall of a top plate of the upper furnace body (3). In the use process, the yield of an existing reflow soldering machine during production can be improved in a variety of ways such as improvement of stroke precision of workpiece conveying and heating temperature compensation of the furnace bodies of a vacuum furnace.

Description

technical field [0001] The invention relates to the technical field of reflow soldering machines, in particular to a vacuum furnace equipment for reflow soldering machines. Background technique [0002] In the current industrial production, reflow soldering machines are often used for reflow soldering of PCB circuit boards, among which the vacuum furnace is the core functional component of the reflow soldering machine. [0003] But the existing vacuum furnace has many deficiencies, for example: in the existing reflow soldering machine, the PCB circuit board needs to be preheated before being sent into the vacuum furnace by the furnace conveying assembly, but at a higher temperature, it is easy to Insufficient friction between the furnace conveying component and the PCB circuit board occurs, such as the board introducing device of the reflow soldering machine disclosed in a patent for the furnace conveying component (patent application number 200820046891.4) that the applican...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/047B23K3/08
CPCB23K3/047B23K3/08B23K2101/42
Inventor 黎健伟
Owner 东莞市健时自动化设备有限公司
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