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Sensor and electronic device

A sensor and circuit board technology, applied in the field of sensor packaging, can solve problems affecting sensor performance and other issues

Inactive Publication Date: 2020-02-14
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to propose a sensor that aims to solve the technical problem that the wires connected to the external circuit will affect the performance of the sensor

Method used

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0045] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0046] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses a sensor and an electronic device, and the sensor comprises a metal housing with an opening at one end, wherein one side wall of the metal housing is provided with a conductivethrough hole; an insulating layer arranged on the surface of the metal housing and the inner wall surface of the conductive through hole; a circuit board arranged at the opening of the metal housing; wherein the circuit board is provided with an electric connection position corresponding to the conductive through hole; a bonding layer arranged between the open end of the metal housing and thecircuit board so as to connect the open end of the metal housing with the circuit board; a sensor chip arranged in the metal housing; and an electric connecting piece arranged in the conductive through hole, wherein one end of the electric connecting piece is electrically connected with the electric connecting position, and the other end of the electric connecting piece is used for being connected with an external circuit. Therefore, the performance of the sensor can be prevented from being influenced by the electric connection structure of the sensor and the external circuit, and the connection of the sensor and the external circuit becomes convenient and simple.

Description

technical field [0001] The invention relates to the technical field of sensor packaging, in particular to a sensor and electronic equipment. Background technique [0002] The packaging structure of sensors (such as MEMS microphones, etc.) generally includes a circuit board, a casing with an opening, and a sensor chip. The casing and the circuit board are packaged to form a cavity structure, and the sensor chip is installed in the cavity structure. [0003] Sensors are usually used in electronic equipment (such as mobile phones, etc.), that is, the sensor needs to be connected to an external circuit; the usual method is to open a through hole on the housing, and then connect the sensor to the external circuit through a wire. As such, the wires can affect the performance of the sensor. Contents of the invention [0004] The main purpose of the present invention is to propose a sensor, aiming to solve the technical problem that the wires connected with the external circuit w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/08H04R1/02
CPCH04R1/08H04R1/02
Inventor 于永革
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD