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Easily-prepared thermal visbreaking adhesive tape and preparation method thereof

A technology of adhesive tape and glue, which is applied in the direction of film/sheet adhesive, adhesive, pressure-sensitive film/sheet, etc., can solve the problem of inability to prepare heat-releasing adhesive tape, and achieve the effect of avoiding selectivity

Pending Publication Date: 2020-02-21
KUNSHAN BYE MACROMOLECULE MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a kind of easy-to-prepar thermal adhesive tape and preparation method thereof, to solve the problem that some adhesive systems proposed in the above-mentioned background technology cannot prepare thermal adhesive tape

Method used

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  • Easily-prepared thermal visbreaking adhesive tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] see figure 1 , the invention provides an easy-to-prepar thermal adhesive tape and a preparation method thereof, comprising a plastic substrate 1 coated with a thermal adhesive functional layer 2, the thermal adhesive functional layer 2 is debonded by heat The viscose is coated on the plastic base material 1 and cured to form, the thermal detackification functional layer 2 is coated with an adhesive layer 3, the adhesive layer 3 is coated with a release film 4, the plastic base material 1, the thermal detackification functional layer 2. Both the adhesive layer 3 and the release film 4 are bonded and fixed with an adhesive.

[0024] Specifically, the heat-viscosity-reducing adhesive is made by mixing resin, curing agent, solvent, self-expanding microsphere foaming agent, and toner.

[0025] Specifically, the adhesive is a solvent-type high-temperature-resistant polyacrylate pressure-sensitive adhesive.

[0026] Specifically, the plastic substrate 1 is one of 5-150 μm po...

Embodiment 2

[0036] see figure 1 , the invention provides an easy-to-prepar thermal adhesive tape and a preparation method thereof, comprising a plastic substrate 1 coated with a thermal adhesive functional layer 2, the thermal adhesive functional layer 2 is debonded by heat The viscose is coated on the plastic base material 1 and cured to form, the thermal detackification functional layer 2 is coated with an adhesive layer 3, the adhesive layer 3 is coated with a release film 4, the plastic base material 1, the thermal detackification functional layer 2. Both the adhesive layer 3 and the release film 4 are bonded and fixed with an adhesive.

[0037] Specifically, the heat-viscosity-reducing adhesive is made by mixing resin, curing agent, solvent, self-expanding microsphere foaming agent, and toner.

[0038] Specifically, the adhesive is a solvent-type high-temperature-resistant polyacrylate pressure-sensitive adhesive.

[0039] Specifically, the plastic substrate 1 is one of 5-150 μm po...

Embodiment 3

[0049] see figure 1, the invention provides an easy-to-prepar thermal adhesive tape and a preparation method thereof, comprising a plastic substrate 1 coated with a thermal adhesive functional layer 2, the thermal adhesive functional layer 2 is debonded by heat The viscose is coated on the plastic base material 1 and cured to form, the thermal detackification functional layer 2 is coated with an adhesive layer 3, the adhesive layer 3 is coated with a release film 4, the plastic base material 1, the thermal detackification functional layer 2. Both the adhesive layer 3 and the release film 4 are bonded and fixed with an adhesive.

[0050] Specifically, the heat-viscosity-reducing adhesive is made by mixing resin, curing agent, solvent, self-expanding microsphere foaming agent, and toner.

[0051] Specifically, the adhesive is a solvent-type high-temperature-resistant polyacrylate pressure-sensitive adhesive.

[0052] Specifically, the plastic substrate 1 is one of 5-150 μm pol...

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Abstract

The invention belongs to the technical field of protective films and adhesive tapes, and specifically discloses an easily-prepared thermal visbreaking adhesive tape and a preparation method thereof. The thermal visbreaking adhesive tape comprises a plastic base material, which is coated with a thermal visbreaking functional layer, wherein a thermal visbreaking adhesive is coated on the plastic base material and is cured to form the thermal visbreaking functional layer, the thermal visbreaking functional layer is coated with an adhesion layer, and the adhesion layer is coated with a release film. According to the invention, the plastic base material is coated with the thermal visbreaking functional layer, the thermal visbreaking functional layer is coated with the adhesion layer, and finally the adhesion layer is compounded with the release film; and the working principle is that when the external temperature reaches above the working temperature of the thermal visbreaking functional layer, the microspheres in the thermal visbreaking adhesive tape expand by several times or even dozens of times to cause the foaming of the adhesion layer so as to make the surface become rough to reduce the viscosity, so that the thermal visbreaking functional layer and the adhesion layer are processed in two procedures so as to avoid the selectivity of the microspheres to the adhesive in the traditional thermal visbreaking adhesive tape preparation process.

Description

technical field [0001] The invention belongs to the technical field of protective films and adhesive tapes, and in particular relates to an easy-to-prepare heat-adhesive adhesive tape and a preparation method thereof. Background technique [0002] Heat-adhesive adhesive tape is a unique film that has adhesive force at room temperature and can be bonded like ordinary adhesive films. It can be easily peeled off only by heating when the adhesive force disappears. It will not cause damage to the adherend. It is used in various manufacturing processes of electronic components to automate and save manpower and simplify the process. The thermal debonding protective film can choose flat film, roll, label and other processing shapes, and can also choose The heating temperature when peeling off, the debonding tape has great advantages in the temporary fixing of electronic components, avoiding scratches and damage of products, especially for wafer cutting or substrate cutting, back gri...

Claims

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Application Information

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IPC IPC(8): C09J7/20C09J7/50C09J7/38C09J7/40
CPCC09J7/20C09J7/38C09J7/40C09J7/50C09J2203/326C09J2301/122C09J2301/302C09J2433/003
Inventor 喻四海车荣升朱恒志施法宽
Owner KUNSHAN BYE MACROMOLECULE MATERIAL CO LTD
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