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A high-temperature alloy plasma electrochemical grinding device

An electrochemical grinding and plasma technology, applied in the direction of electrolysis components, electrolysis process, etc., can solve the problems of poor operating conditions of the peeling method, and achieve the effects of improved productivity, no change in structure, and simple process equipment.

Active Publication Date: 2021-09-17
HOHAI UNIV CHANGZHOU
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] In order to solve the problem of poor operating conditions of the peeling method in the prior art, the present invention provides a high-temperature alloy plasma electrochemical grinding device, which has plasma flexible contact and realizes the preferential peeling of microscopic convex peaks and grinding until the surface is smooth, and then Then peel off and grind on the microcosmic second-highest convex peak. This technology has the ability to peel off and grind without being affected by the composition, structure and shape of the superalloy.

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  • A high-temperature alloy plasma electrochemical grinding device
  • A high-temperature alloy plasma electrochemical grinding device

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Embodiment Construction

[0019] The present invention will be further explained in detail below in conjunction with the accompanying drawings and embodiments, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0020] Such as Figure 1-2 As shown, the high-temperature alloy plasma electrochemical grinding device in the present invention includes a rotating feed electrode structure, a housing and a water mist spraying device. The rotating feed electrode structure is composed of a rotatable cathode, a spring and a brush head, and the brush head includes a ceramic Flange and carbon fiber wire, the tip of the cathode is connected to the spring and the ceramic ferrule through a stud, one end of the ceramic ferrule is connected to the stud and the other end is connected to the ceramic flange, carbon fiber wire is distributed around the flange ring, and the cathode is driven by a servo motor for spiral rotation The feed spring and the b...

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Abstract

The invention relates to a high-temperature alloy plasma electrochemical grinding device, which includes a cathode, and a nanosecond pulse voltage is applied between the cathode and the alloy to be ground during operation; a grinding brush includes a brush head and a rotating disk, and the brush head is provided with On the turntable; spiral arc drawing device, used to connect the cathode and the grinding brush, one end of the spiral arc drawing device is connected to the cathode and the other end is connected to the turntable; the water mist spraying device is used to generate and spray deionized water mist; drive The device is used to drive the cathode, the grinding brush and the spiral arc device to rotate around the central axis. The grinding device in the present invention has plasma flexible contact and realizes the preferential peeling and grinding of the microscopic raised points until the surface is smooth, and then peels off and grinds the microscopic second-highest raised points.

Description

technical field [0001] The invention relates to an alloy grinding device, in particular to a high-temperature alloy plasma electrochemical grinding device. Background technique [0002] The peeling of superalloy surface in additive manufacturing can reduce the surface roughness of workpiece. Commonly used superalloy surface exfoliation processes include chemical exfoliation or electrochemical finishing and mechanical exfoliation. However, chemical stripping or electrochemical finishing is usually carried out in a solution of hydrofluoric acid and nitric acid configured in a certain proportion, the production environment is harsh, and it is limited by the composition of stainless steel. Mechanical peeling also has the problem of high hardness due to different production environments and components. Therefore, it has long processing time, poor operating conditions, need for follow-up processing, etc., and has high cost limitations. Contents of the invention [0003] In or...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25F3/16C25F7/00
CPCC25F3/16C25F7/00
Inventor 蒋永锋易恬安包晔峰陈秉岩
Owner HOHAI UNIV CHANGZHOU
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