Array substrate and preparation method thereof

An array substrate and substrate technology, applied in the field of array substrates and its preparation, can solve problems such as metal inner corner rounding, achieve the effects of avoiding metal inner corner rounding, improving contrast, and improving light leakage in dark states

Active Publication Date: 2020-02-21
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides an array substrate and a preparation method thereof, so as to alleviate the problem of rounded corners of metal inner corners existing in existing array substrates

Method used

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  • Array substrate and preparation method thereof
  • Array substrate and preparation method thereof
  • Array substrate and preparation method thereof

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Embodiment Construction

[0042] The technical solutions in the embodiments and / or examples of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention. Obviously, the embodiments and / or examples described below are only part of the implementation of the present invention. schemes and / or examples, rather than all implementations and / or examples. Based on the implementations and / or examples in the present invention, all other implementations and / or examples obtained by persons of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0043] The directional terms mentioned in the present invention, such as [top], [bottom], [left], [right], [front], [back], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the pre...

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Abstract

The invention provides an array substrate and a preparation method thereof. The preparation method comprises the steps of preparing a metal layer, preparing a negative photoresist layer on the metal layer, exposing and developing the negative photoresist layer, etching the metal layer, and removing the negative photoresist layer. According to the preparation method, the metal layer is patterned byusing a negative photoresist, and the characteristic of light retention of the negative photoresist is utilized. During exposure, the negative photoresist exposure amount at the corresponding position of the corner in the pattern is enough. During development, the negative photoresist at the corresponding position of the corner in the pattern can be completely dissolved in the developing solutionwithout residues. The etching effect of the corner in the metal in the subsequent metal etching process is ensured, and the problem that the corner in the metal is rounded due to insufficient photoresist exposure is avoided. Therefore, the phenomenon of dark-state light leakage of a display device is improved, and the contrast ratio of a product is improved.

Description

technical field [0001] The invention relates to the display field, in particular to an array substrate and a preparation method thereof. Background technique [0002] With the increasing pursuit of high-end products, the transmittance and contrast of displays are facing higher and higher requirements. [0003] However, in the array substrate, due to the inner corner rounding phenomenon of the metal lines in the metal layer, the metal is not perpendicular or parallel to the polarizer, and when the incident polarized light passes through the non-horizontal and non-perpendicular metal corners, its polarization state will be different. Changes occur, resulting in light leakage, which in turn reduces contrast, resulting in substandard product specifications. [0004] Therefore, there is a problem of rounded corners of metal inner corners in the existing array substrate, which needs to be solved. Contents of the invention [0005] The invention provides an array substrate and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/84H01L27/12
CPCH01L27/1288H01L27/124
Inventor 钟舒婷
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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