Lead frame and method for manufacturing rotary mode power module by using lead frame

Abstract

The invention provides a lead frame. According to the invention, each leading-out terminal is fixed relative to the external frame through a connecting rod. The leading-out terminals and the externalframe form a whole body. The specific positions of the leading-out terminals are designed and arranged in advance according to actual conditions. A ceramic lining plate and a lead frame are positionedby a tool. The connection positions of all the leading-out terminals and the ceramic lining plate can be accurately positioned through one-time positioning of the ceramic lining plate relative to thelead frame, so the positioning and connecting technological process is simplified, the positioning accuracy is improved, the production efficiency and the product yield are improved, the manufacturing period is shortened, the complexity of automatic production is reduced, and possibility is provided for achieving integrated automatic positioning connection. The invention further provides a methodfor manufacturing the rotary mode power module, the complexity of the sintering process is reduced by positioning and fixing the leading-out terminals and then bending the leading-out terminals, theprecision of the sizes of the leading-out terminals is guaranteed, and operation and machining are more convenient.

Description

technical field [0001] The invention belongs to the field of semiconductor modules, in particular to a lead frame and a method for making a rotary mold power module by using the lead frame. Background technique [0002] The research and development and manufacture of power semiconductors have always been the core focus and the top priority of the development of the electronic power device industry in all countries in the world, ranging from household air conditioner frequency conversion systems to power locomotive traction transmission systems to the control of renewable energy electric vehicles Both power inverter systems and power semiconductor devices are inseparable. The packaging and manufacturing of automotive-grade power semiconductor devices and their reliability have been facing various challenges. The proposal of the rotary mold power module not only simplifies the module packaging process and steps, but also provides physical and electrical protection for the ins...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problems in the prior art that each lead-out terminal needs to be assembled and positioned and sintered separately, which prolongs the manufacturing cycle and increases the complexity of automatic module production, the present invention provides a lead frame and the use of the lead frame to make a rotary mold power module method, the specific scheme is as follows:

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