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Display substrate and manufacturing method thereof, and display device

A technology of display substrate and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as wire breakage, and achieve the effect of ensuring yield

Active Publication Date: 2020-02-21
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a display substrate and its manufacturing method, and a display device, which are used to solve the problem that the wiring on the top layer is prone to breakage in the via hole when connecting the double-layer wiring through the via hole

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  • Display substrate and manufacturing method thereof, and display device
  • Display substrate and manufacturing method thereof, and display device
  • Display substrate and manufacturing method thereof, and display device

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Embodiment Construction

[0039] In order to further illustrate a display substrate, a manufacturing method thereof, and a display device provided by the embodiments of the present invention, a detailed description will be given below in conjunction with the accompanying drawings.

[0040] Based on the problems existing in the background technology, the inventors of the present invention have found through research that in the related art, when connecting double-layer traces through via holes, the reasons for the problem that the traces on the top layer are prone to break in the via holes are as follows:

[0041] Such as figure 1 with figure 2 As shown, two layers of insulation are included between the double layer traces ( figure 1 (not shown in ) as an example, the process flow of making vias on the two insulating layers in the related art includes: first making a top layer via hole 11 on the second insulating layer 20, and the top layer via hole 11 is formed on the substrate 70 of the display devi...

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Abstract

The invention provides a display substrate and a manufacturing method thereof, and a display device, relates to the display technology field, and aims at solving a problem that when a double-layer wire is connected through a via hole, the wire at a top layer is easy to break in the via hole. The display substrate comprises a first conductive pattern, a second conductive pattern, a first insulatinglayer and a second insulating layer, wherein the first conductive pattern and the second conductive pattern are successively arranged on a substrate in a stacked mode along a direction away from thesubstrate; the first insulating layer and the second insulating layer are located between the first conductive pattern and the second conductive pattern; the first insulating layer is located betweenthe first conductive pattern and the second insulating layer; a first via hole is arranged in the first insulating layer; and the second insulating layer is provided with a second via hole, an orthographic projection of the first via hole on the substrate is surrounded by the orthographic projection of the second via hole on the substrate, the orthographic projection of the second via hole on thesubstrate is located in the orthographic projection of the first conductive pattern on the substrate, and the second conductive pattern is coupled with the first conductive pattern through the secondvia hole and the first via hole. The display substrate provided by the invention is used for displaying a picture.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] With the growing demand for display, high-precision display technology has been widely valued by people. In related technologies, high-precision display devices generally have thicker electrode traces, and at the same time, in order to reduce the voltage drop generated by the electrode traces when transmitting signals, the electrode traces are set as double-layer traces, and the double-layer traces The layer traces are electrically connected through the via holes provided on the insulating layer between the double-layer traces, so as to reduce the impedance of the electrode traces, reduce the voltage drop on the loop, and thereby reduce power consumption. However, in the related art, when the two-layer traces are connected through via holes, the problem that the traces on th...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1244H01L27/1259
Inventor 程磊磊
Owner BOE TECH GRP CO LTD
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