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Hundred million-level pixel array camera device and camera method thereof

A camera device and pixel array technology, which is applied in the field of billion-level pixel array camera devices, can solve the problems of increased exposure time and processing time, inability to be used portablely, difficulties in use and installation, etc., and achieve the effect of improving the viewing angle and resolution

Pending Publication Date: 2020-02-21
湖南傲英创视信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the application of industrial cameras on the market is mainly limited by the manufacturing process, optical resolution, phase difference, sampling rate and other conditions, resulting in the limitation of single-chip video capture resolution. 80M pixels are a bottleneck for most manufacturers. In the current industry Under the means, it can only be solved by continuously enlarging the chip area, but the cost problem caused by this will increase exponentially
In order to increase the resolution, some manufacturers will reduce the pixel size of the chip, etc., resulting in the need to increase the exposure time and processing time to obtain a clear image, and the output frame rate can only reach 1 or 2 frames per second. Method can only make camera phones, not live cameras
At present, some manufacturers have not obtained high-resolution cameras, so that the pixels have exceeded 100 million levels, and hundreds of 4K x 4K cameras have been superimposed in volume, and multiple lenses have been used to realize the so-called compound-eye cameras. The cameras produced in this way are huge in size. Extremely difficult to use and install, not portable
And multi-part cameras can only output a video with a fixed frame format and a fixed field of view, and there is no way to display details of interest inside the field of view in high resolution

Method used

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  • Hundred million-level pixel array camera device and camera method thereof
  • Hundred million-level pixel array camera device and camera method thereof
  • Hundred million-level pixel array camera device and camera method thereof

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Experimental program
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Effect test

Embodiment 1

[0040] Such as figure 1 As shown, this embodiment provides a billion-level pixel array imaging device, including:

[0041] The imaging module is used to obtain the optical information of the object to be photographed, and obtain the imaging photon information according to the optical information;

[0042] The sensor control module is used to preprocess the imaging photon information to obtain electronic image signals;

[0043] The acquisition module is used to collect electronic image signals in real time and send them to the processing module through the transmission module after encoding and processing;

[0044] The transmission module is used to convert the encoded electronic image signal into an optical fiber signal and transmit it to the processing module;

[0045] The processing module is used for receiving the optical fiber signal and processing it to generate an image.

[0046] The aforementioned billion-level pixel array camera device can improve the viewing angle ...

Embodiment 2

[0063] This embodiment provides an imaging method applied to the above billion-level pixel array imaging device, including the following steps:

[0064] The imaging module is used to obtain the optical information of the object to be photographed, and the imaging photon information is obtained according to the optical information;

[0065] Preprocessing the imaging photon information through the sensor control module to obtain electronic image signals;

[0066] The acquisition module is used to collect electronic image signals in real time and encode them, and then send them to the processing module through the transmission module;

[0067] The transmission module converts the encoded electronic image signal into an optical fiber signal and transmits it to the processing module;

[0068] The fiber optic signal is received by the processing module and processed to generate an image.

[0069] In this embodiment, the imaging module includes a lens and a photosensitive surface o...

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Abstract

The invention relates to the technical field of industrial cameras, and discloses a hundred million-level pixel array camera device and a camera method thereof to improve the resolution of an industrial camera. The camera device comprises an imaging module which is used for obtaining the optical information of a to-be-photographed object, and obtaining the imaging photon information according to the optical information; a sensor control module which is used for preprocessing the imaging photon information to obtain an electronic image signal; an acquisition module which is used for acquiring the electronic image signals in real time, encoding the electronic image signals and sending the encoded electronic image signals to a processing module through a transmission module; the transmissionmodule which is used for converting the coded electronic image signal into an optical fiber signal and transmitting the optical fiber signal to the processing module; and the processing module which is used for receiving the optical fiber signal and processing to generate an image.

Description

technical field [0001] The present invention relates to the technical field of industrial cameras, in particular to a camera device with a billion-level pixel array and a camera method thereof. Background technique [0002] In daily use, industrial cameras are widely used in video detection, scene learning and other scenarios. As the usage rate of industrial cameras is getting higher and higher, people's requirements for industrial cameras are also getting higher and higher. At present, the application of industrial cameras on the market is mainly limited by the manufacturing process, optical resolution, phase difference, sampling rate and other conditions, resulting in the limitation of single-chip video capture resolution. 80M pixels are a bottleneck for most manufacturers. In the current industry Under the means, it can only be solved by continuously enlarging the chip area, but the cost problem caused by this will increase exponentially. In order to increase the resolut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225H04N7/22
CPCH04N7/22H04N23/55H04N23/54
Inventor 尹江明陈小天唐新春王大雷邵逢仙黄营磊
Owner 湖南傲英创视信息科技有限公司