Quick-dismantling type anti-placing-deviation grinding tool for integrated circuit board production

Abstract

The invention relates to the technical field of integrated circuit board machining grinding tools, and discloses a quick-dismantling type anti-placing-deviation grinding tool for integrated circuit board production. The quick-dismantling type anti-placing-deviation grinding tool comprises a work cabinet, wherein a cabinet door is movably mounted on the front surface of the work cabinet, a movablewheel is fixedly installed at the bottom of the work cabinet, a table surface is fixedly installed at the top of the work cabinet, two guide rails I, located at the top of the work cabinet, are fixedly mounted in an inner cavity of the table surface, and sliding grooves I are formed in the tops of the guide rails I. According to the quick-dismantling type anti-placing-deviation grinding tool for integrated circuit board production, through the sliding effect between the guide rails I, the sliding grooves I, sliding blocks I and frame rods arranged at the top of the work cabinet, two calipers fixed together can be easily separated when a grinding disc on the grinding tool needs to be replaced, and meanwhile only a fixing disc needs to be pulled out of slots on the calipers when the grindingdisc needs to be replaced, and at the same time the grinding disc can be quickly replaced by rotating fastening rings which sleeve the exteriors of the calipers in a threaded mode.

Description

technical field [0001] The invention relates to the technical field of abrasive tools for processing integrated circuit boards, in particular to a quick-detachable anti-deviation abrasive tool for integrated circuit board production. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits, but it is often said that the integrated circuit board also carries the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board uses semiconductor manufacturing technology. Many transistors, resistors, capacitors and other components are fabricated on a smaller single crystal silicon wafer, and the components are combined into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring. [0003] The integrated circuit board will go through the steps of grinding and shaping during the processing process. The abrasive tools for in...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the present invention provides a quick-release type anti-deviation grinding tool produced by integrated circuit boards, which has the advantages of convenient disassembly of the grinding disc and no deviation of the position of the overall grinding tool, and solves the current problem in the market. Abrasives for integrated circuit board processing are often inconvenient to replace the grinding disc during use, and the position of the entire workbench will shift during use.

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