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Photolithography equipment and photolithography method

A lithography equipment, laser technology, used in microlithography exposure equipment, optomechanical equipment, optics, etc.

Active Publication Date: 2022-01-25
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, while current lithographic equipment that uses EUV as a light source in the exposure process is fit for purpose, it has not met many other requirements

Method used

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  • Photolithography equipment and photolithography method
  • Photolithography equipment and photolithography method
  • Photolithography equipment and photolithography method

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Embodiment Construction

[0063] The following description provides many different embodiments, or examples, for implementing various features of the invention. The elements and arrangements described in the following specific examples are only used to express the present disclosure in a concise manner, which are only examples and not intended to limit the present invention. For example, a description of a first feature on or over a second feature includes direct contact between the first and second features, or another feature disposed between the first and second features such that the second feature The first and second features are not in direct contact.

[0064] Words such as first and second in this specification are only used for the purpose of explaining them clearly, and are not used to correspond to or limit claims. In addition, terms such as first feature and second feature are not limited to the same or different features.

[0065] Spatially relative terms, such as above or below, are use...

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Abstract

The present disclosure provides a photolithographic equipment, including an excitation chamber, a target emitter, a main laser emitter, and a laser vacuum device. The target emitter is used for emitting a target towards an excitation area in the excitation cavity. The main laser emitter is used to emit a main pulse laser to the target in the excitation area. The laser vacuum device is used to emit a vacuum laser into the excitation cavity and form a vacuum channel in the excitation cavity. After the laser vacuum device emits the vacuum laser, the target emitter emits the target through the vacuum channel into the excitation area. The lithography equipment provided by the present disclosure can increase the accuracy of the main laser emitter hitting the target.

Description

technical field [0001] The present disclosure mainly relates to a semiconductor device and method, and in particular to a photolithography device and method. Background technique [0002] Semiconductor devices have been used in various electronic applications, such as personal computers, mobile phones, digital cameras, and other electronic equipment. A semiconductor device is basically sequentially formed by depositing insulating or dielectric layers, conductive layers, and semiconductor layer materials onto a wafer, and patterning various material layers using photolithographic techniques to form circuit components and components thereon. manufacture. Many integrated circuits are generally fabricated on a single wafer, and individual dies on the wafer are diced and separated between the integrated circuits along a dicing line. For example, individual dies are basically individually packaged in a multi-chip module or other type of package. [0003] Due to the miniaturizat...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70033
Inventor 张俊霖张汉龙傅中其刘柏村陈立锐郑博中
Owner TAIWAN SEMICON MFG CO LTD