Wafer cleaning equipment
A technology for cleaning equipment and wafers, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc. It can solve problems such as incoherent process flow and long time-consuming cleaning process, and achieve the effect of improving cleaning efficiency
Inactive Publication Date: 2020-03-06
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0005] Since there are 25 wafers in each cassette, if all 25 wafers in a cassette are to be cleaned, more than three cycle cycles are required, so that the cleaning process will take a long time, making the entire Incoherent process flow
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[0038] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the cleaning equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.
[0039] The present invention provides a wafer cleaning device, which includes a multi-layer cleaning structure, a loading chamber, a transmission channel, a first transmission mechanism and a second transmission mechanism. Among them, the multi-layer cleaning structure is arranged in sequence in the vertical direction, and each layer of cleaning structure includes a plurality of cleaning chambers; the loading chamber is located on one side of the wafer cleaning equipment for storing wafers; the first transmission mechanism and the second transmission mechanism Located on the transfer channel, the first transfer mechanism is used to transfer the wafer between the loading chamber and the second transfer mechanism, and the ...
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The invention provides wafer cleaning equipment comprising a multi-layer cleaning structure, a loading cavity, a transmission channel, a first transmission mechanism and a second transmission mechanism, wherein the multi-layer cleaning structure is sequentially arranged in the vertical direction, and each layer of cleaning structure comprises a plurality of cleaning cavities. The loading cavity islocated at one side of the wafer cleaning equipment and is used for storing wafers. The first transmission mechanism and the second transmission mechanism are arranged on the transmission channel. The first transmission mechanism is used for transporting the wafers between the loading cavity and the second transmission mechanism. The second transmission mechanism is used for transporting the wafers into any cleaning cavity. The multi-layer cleaning structure is sequentially arranged along the vertical direction, and the number of the cleaning cavities is multiplied according to the number ofthe stacked layers under the condition that the occupation area is the same as that of the cleaning equipment in the prior art, thus improving the cleaning efficiency.
Description
technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a wafer cleaning device. Background technique [0002] In the semiconductor manufacturing process, semiconductor equipment is divided into two types of cleaning equipment: single-chip and batch (multi-chip), that is, a process chamber cleans one piece at a time and cleans 25 pieces (or 50 pieces) at a time. In the semiconductor manufacturing process, the front-end cleaning process generally adopts batch cleaning, and the back-end cleaning process generally adopts single-chip cleaning. [0003] figure 1 It is a schematic structural diagram of a single wafer cleaning equipment provided in the prior art. Such as figure 1 As shown, the single-wafer cleaning equipment includes eight process chambers 1 and two manipulators 2. The eight process chambers are arranged in two rows at intervals, and there is a transmission channel in the middle of the two ...
Claims
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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02057H01L21/67017H01L21/67178H01L21/67207
Inventor 赵宏宇张豹王锐廷
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD