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mems microphone warpage compensation method and mems microphone wafer

A compensation method and microphone technology, which can be used in televisions, semiconductor electrostatic transducers, generators/motors, etc., and can solve problems such as difficulty in manufacturing MEMS microphones with special structures, large warpage, etc.

Active Publication Date: 2021-09-14
SEMICON MFG ELECTRONICS (SHAOXING) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to solve the problem that the warpage caused by the traditional process is too large, making it difficult to manufacture a MEMS microphone with a special structure, and to provide a MEMS microphone warpage compensation method, including the following steps:

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  • mems microphone warpage compensation method and mems microphone wafer
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Embodiment Construction

[0030] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. A preferred embodiment of the application is shown in the drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associa...

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Abstract

The present application relates to a MEMS microphone warpage compensation method and a MEMS microphone wafer; the MEMS microphone warpage compensation method includes: providing a substrate, the front of the substrate is formed with a front film layer; grinding and thinning the back of the substrate to form damage Layer, the grinding mesh range is 200 mesh-3000 mesh; the back of the substrate is etched to form a back cavity, and the damage layer is formed on the back of the substrate, and the reverse surface stress is applied to the back of the substrate through the damaged layer to offset the substrate. The warping stress of the warping reduces the warping degree of the substrate, which is beneficial to the implementation of the subsequent process of the MEMS microphone wafer.

Description

technical field [0001] The present application relates to the technical field of wafer manufacturing, in particular to a MEMS microphone warpage compensation method and a MEMS microphone wafer. Background technique [0002] In the production process of conventional MEMS (Micro-Electro-Mechanical System, micro-electromechanical system) microphones, the backside thinning process is performed to thin the wafer with a certain thickness (for example, 725 microns), and then the back cavity of the wafer is etched. . Under the existing process conditions, the warpage of the conventional MEMS microphone wafer after grinding is 200-300 microns, the warpage after back cavity etching is 500-600 microns, and the warpage of the wafer is 500-600 microns , MEMS microphones can be processed in subsequent processes, but for MEMS microphones with special structures, the compressive stress of the front film layer is much greater than that of conventional MEMS microphones. After the thinning pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00H04R19/04H04R31/00B81C1/00B81B7/02
CPCB81B7/02B81B2201/0257B81C1/00206H04R19/005H04R19/04H04R31/00
Inventor 李绪民魏丹珠单伟中
Owner SEMICON MFG ELECTRONICS (SHAOXING) CORP