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Display panel manufacturing method and display panel

A technology for a display panel and a manufacturing method, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of poor soldering, poor manufacturing process, and poor solder paste printing of miniature light-emitting diodes, so as to avoid poor solder paste printing. , Improve performance and production yield, prevent warpage

Pending Publication Date: 2022-06-03
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiments of the present application provide a method for manufacturing a display panel and a display panel, which can solve the warpage of the driving motherboard caused by the large difference between the thermal expansion coefficient of the ink layer and the thermal expansion coefficient of the driving motherboard after the ink layer is baked and hardened. problems, as well as poor solder paste printing caused by warpage of the drive motherboard, poor soldering of micro-LEDs, and other poor manufacturing processes

Method used

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  • Display panel manufacturing method and display panel
  • Display panel manufacturing method and display panel
  • Display panel manufacturing method and display panel

Examples

Experimental program
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Embodiment 1

[0036] see Figure 1 to Figure 7 , figure 1 A schematic diagram of the first flow steps of a method for manufacturing a display panel provided in an embodiment of the present application; figure 2 A schematic diagram of the second process steps of a method for manufacturing a display panel provided in an embodiment of the present application; image 3 A first process schematic diagram of a method for manufacturing a display panel provided by an embodiment of the present application; Figure 4 A schematic diagram of a second process of a method for manufacturing a display panel provided by an embodiment of the present application; Figure 5 A schematic diagram of a third process of a method for manufacturing a display panel provided by an embodiment of the present application; Image 6 A fourth process schematic diagram of a method for manufacturing a display panel provided by an embodiment of the present application; Figure 7 This is a schematic diagram of a third proces...

Embodiment 2

[0073] This embodiment is the same as or similar to the above-mentioned embodiment, and the difference is that the manufacturing method of the display panel is further described.

[0074] In some embodiments, the manufacturing method of the display panel further includes steps: S700, S800.

[0075] S700: disposing an encapsulation layer on a miniature light-emitting diode.

[0076] Specifically, an encapsulation layer is provided on the miniature light-emitting diode, and the encapsulation layer is not limited to the optical glue layer and the encapsulation cover plate.

[0077] S800: Cut the drive motherboard to make multiple display panels.

[0078] Specifically, the cutting and driving motherboard 10 is made into a plurality of display panels, each opening 21 corresponds to one display panel, and can be cut according to the actual size of the display panel.

[0079] It should be noted that the manufacturing method of the display panel includes steps: S100, S200, S300, S40...

Embodiment 3

[0084] An embodiment of the present application provides a display panel, and the display panel is manufactured by using the manufacturing method of any one of the above-mentioned embodiments.

[0085] Specifically, for the display panel manufactured by the method for manufacturing a display panel of any one of the above-mentioned embodiments, in the manufacturing process, in the process of baking and hardening the protective layer, a mechanical device is used to move away from the protective layer from the driving mother first. One side of the board is against the second area of ​​the driving motherboard, the force of the mechanical device on the driving motherboard offsets the warping stress, and the warping stress generated by the protective layer is slowly released, which can prevent the thermal expansion coefficient of the ink layer and the driving force. The drive motherboard is warped due to the large difference in the thermal expansion coefficient of the motherboard, th...

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PUM

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Abstract

The invention discloses a manufacturing method of a display panel and the display panel, and the method comprises the steps: S100, providing a driving mother board which comprises a first region and a second region located at the edge of the driving mother board; s200, forming a protective layer on the driving mother board; s300, forming a plurality of openings in the protection layer in the first region; s400, the driving mother board is arranged on a baking table, mechanical equipment is used for abutting against the second area of the driving mother board from the side, away from the driving mother board, of the protection layer, and then the protection layer is baked and hardened; and S500, arranging a plurality of micro light-emitting diodes arranged in an array in each opening. In the baking and hardening process of the protective layer, the mechanical equipment is firstly used for abutting against the second area of the driving mother board from the side, away from the driving mother board, of the protective layer, the acting force of the mechanical equipment on the driving mother board counteracts the warping stress, the driving mother board can be prevented from warping, and the performance and the production yield of the display panel are improved.

Description

technical field [0001] The present application relates to the field of display, and in particular, to a manufacturing method of a display panel and a display panel. Background technique [0002] Major panel manufacturers are actively developing miniature light-emitting diode display panels (MinLED panels or MicroLED panels), which are expected to serve as the core technology of next-generation display panels. In the manufacturing process of the miniature light-emitting diode display panel, it is necessary to arrange solder paste on the driving motherboard by stencil printing. The solder paste is used to electrically connect the micro-LEDs to the traces or electrodes on the driving motherboard. In the process of stencil printing, if the traces or electrodes on the drive motherboard are crushed or scratched, an ink layer needs to be applied first to prevent damage to the traces or electrodes. [0003] However, due to the large difference between the thermal expansion coeffici...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L21/67H01L21/683H01L33/62
CPCH01L27/156H01L33/62H01L21/6838H01L21/67138
Inventor 赵永超
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD