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High-heat-dissipation and low-loss PCB and manufacturing method

A technology of PCB board and manufacturing method, which is applied in the direction of circuit heating device, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve the problems of incomplete filling of thermal and conductive adhesive, degradation of circuit board performance, and strict pressing conditions, etc., to achieve Simplify the cutting preparation process, reduce the processing time, and optimize the production process

Pending Publication Date: 2020-03-13
广州广合科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The second method is: add conductive heat-conducting adhesive between the heat-conducting buried block and the circuit board during pressing to improve heat dissipation and reduce dielectric loss. Since the heat-conducting block is embedded in the buried hole inside the circuit board by opening a buried hole, this The pressing conditions of this manufacturing process are relatively strict, and it is prone to the problem that the thermal conductive adhesive cannot completely fill the gap between the buried hole and the thermal block, resulting in a decrease in the performance of the circuit board or even unusable

Method used

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  • High-heat-dissipation and low-loss PCB and manufacturing method
  • High-heat-dissipation and low-loss PCB and manufacturing method
  • High-heat-dissipation and low-loss PCB and manufacturing method

Examples

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Effect test

Embodiment 1

[0055] A PCB board with high heat dissipation and low loss. The structure includes a board body composed of a high-frequency core board 1 and a conventional core board 2 superimposed together. A layer of prepreg 7 is sandwiched between the high-frequency core board 1 and the conventional core board 2, and the laminated structure of the high-frequency core board 1, the prepreg 7, and the conventional core board 2 are fused and riveted for fixation to form a stable board body structure. The high-frequency core board 1 is provided with a first through hole 11 through slot milling, and the conventional core board 2 is provided with a second through hole 21 through slot milling. The first through hole 11 communicates with the second through hole 21 to form a step Hole 3. In this embodiment, the diameter of the first through hole 11 opened on the high-frequency core board 1 is smaller than the diameter of the second through hole 21 opened on the conventional core board 2. The heat ...

Embodiment 2

[0062] A method for manufacturing PCB boards with high heat dissipation and low loss. The first step is to match the shape of the heat-conducting element 4, and mill grooves on the surface of the high-frequency core board 1 and the surface of the conventional core board 2, respectively. The first through hole 11 and the second through hole 21 for accommodating the heat-conducting element 4; the second step is to align the conventional core board 2 and the high-frequency core board 1 and lay the prepreg 7 between them, and then fusion And it is fixed by riveting. At this time, the first through hole 11 communicates with the second through hole 21 to form a stepped hole 3. In the third step, the outer shape of the thermally conductive adhesive layer 6 is cut according to the size of the second through hole 21. Cut and open a third through hole 61 on the surface of the thermally conductive adhesive layer 6. The position of the third through hole 61 corresponds to the position of th...

Embodiment 3

[0064] A method for manufacturing PCB boards with high heat dissipation and low loss. The first step is to match the shape of the heat-conducting element 4, and perform slot milling on the surface of the high-frequency core board 1 and the surface of the conventional core board 2, respectively. The first through hole 11 and the second through hole 21 for accommodating the heat-conducting element 4; the second step is to align the conventional core board 2 and the high-frequency core board 1 and lay the prepreg 7 between them, and then fusion And it is fixed by riveting. At this time, the first through hole 11 communicates with the second through hole 21 to form a stepped hole 3. In the third step, the outer shape of the thermally conductive adhesive layer 6 is cut according to the size of the second through hole 21. Cut and open a third through hole 61 on the surface of the thermally and electrically conductive adhesive layer 6. The position of the third through hole 61 correspo...

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Abstract

The invention relates to a PCB with high heat dissipation and low loss. The PCB comprises a high-frequency core board and a conventional core board which are attached to each other, a first through hole is formed in the plate surface of the high-frequency core plate; a second through hole is formed in the plate surface of the conventional core plate; the first through hole and the second through hole are communicated to form a stepped hole; a stepped heat conduction element is arranged in the stepped hole in a matched mode, the heat conduction element comprises a base layer and a stepped layerprotruding out of the surface of the base layer, the stepped layer is matched with the second through hole, the base layer is matched with the first through hole, a gap is formed between the steppedhole and the heat conduction element, and a heat conduction and electric conduction adhesive layer is arranged in the gap. The heat conduction element is arranged in a transparent penetrating mode, the grounding function is achieved, the performance of the circuit board is more stable, heat conduction and electric conduction glue filling is more sufficient, the production requirement is lowered, the production process is simplified, labor hours are saved, and efficiency is improved.

Description

Technical field [0001] The invention relates to the field of PCB board manufacturing, in particular to a PCB board with high heat dissipation and low loss and a manufacturing method. Background technique [0002] With the development of electronic technology, the high-density of products, the miniaturization of components and the surface-mounting become more and more obvious, especially in high-frequency electronic circuits, the higher the frequency of the radio frequency components, the greater the heat generated by their work. Affect the normal operation of electronic circuits and accelerate the aging of working devices. [0003] Embedding heat-conducting elements in the circuit board can effectively speed up the heat dissipation of high-power components. At present, the existing heat dissipation technology mainly includes two methods: external heat conduction element and built-in heat conduction element. External heat-conducting elements increase design space. The built-in he...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00H05K3/46
CPCH05K1/0204H05K3/0044H05K3/4697H05K2201/09845
Inventor 李之源向参军麦美环陈炯辉
Owner 广州广合科技股份有限公司