Die bonder with glue brushing device and working method thereof

Abstract

The invention discloses a die bonder with a glue brushing device and a working method thereof. The die bonder comprises a machine body, a glue containing box and an object carrying plate. The glue containing box is fixedly connected to the upper portion of the machine body, a fixed plate is fixedly connected to the upper portion of the glue containing box, a movable plate is movably connected between the fixed plate and the glue containing box, and a telescopic device used for driving the movable plate is fixedly connected to the fixed plate. A glue outlet rod movably penetrates through the glue containing box; a glue outlet hole is upwards formed in the bottom end of the glue outlet rod; a glue inlet hole communicated with the glue outlet hole is formed in the glue outlet rod in the gluecontaining box; a threaded rod is fixedly connected to the top of the glue outlet rod located above the glue containing box, the upper end of the threaded rod sequentially penetrates through the movable plate and the fixed plate and extends to the position above the fixed plate, a nut is in threaded connection with the threaded rod, the position of a base plate can be adjusted conveniently, and meanwhile glue can be applied to the base plate conveniently.

Description

technical field [0001] The invention relates to a crystal bonder, in particular to a crystal bonder with a glue brushing device and a working method thereof. Background technique [0002] Die bonding machine is the equipment used in the chip loading process in the semiconductor chip packaging process. When working, the tape conveyor clip of the die bonder drives the frame carrying the chip to be transported on the track plane, so that each chip passes through the dispensing position and the loading position in turn for corresponding dispensing and welding operations. [0003] Die bonders are used to realize the electrical connection between semiconductor devices and substrates. However, the existing die bonders are generally inconvenient to control glue dripping on the substrate, so it is inconvenient for the staff to operate, and at the same time, it causes waste of glue. At the same time, it is inconvenient to fix the substrate in the crystal machine. Generally, the subst...

AI Technical Summary

Problems solved by technology

[0003] Die bonders are used to realize the electrical connection between semiconductor devices and substrates. However, the existing die bonders are generally inconvenient to control the dripping of glue on the substrate. At the same time, it is inconvenient to fix the substrate in the crystal machine. Generally, the substrate is placed directly on the carrier board, so it may cause the substrate to move on the carrier board, which is inconvenient for processing.

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