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Chip surface metal residue and contamination cleaning method

A surface metal and cleaning method technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as metal residue, chip misjudgment, failure to find the real cause of failure, etc., to accelerate volatilization, improve success rate, easy to find effects

Pending Publication Date: 2020-03-27
闳康技术检测(上海)有限公司
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Problems solved by technology

[0003] However, the samples after the total delay cannot be ground, and there will be a lot of metal residues on the surface and many small stains adsorbed. The metal residues and stains will lead to misjudgment of the FA of the chip, making it impossible to find the true cause of failure.

Method used

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  • Chip surface metal residue and contamination cleaning method
  • Chip surface metal residue and contamination cleaning method
  • Chip surface metal residue and contamination cleaning method

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Embodiment Construction

[0040] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0041] A method for cleaning metal residue and contamination on the surface of a chip, such as figure 1 shown, including the following steps:

[0042] S1: Place the chip on the wafer. Before placing the chip, use a spray gun to spray a layer of organic reagent from the side. The organic reagent can be ethanol or carbon tetrachloride. The design of spraying from the side can wash away some impurities.

[0043] S2: Spray the organic reagent volatilized by heating. After the organic reagent is sprayed, it will fill the surface of the chip and form tension sides at the corners of the chip. After the tension side is formed, the side of the chip can be prevented from being covered by the organic reagent, and at the same time, the position of the chip on the chemical reagent can be stabilized, and the organic reagent on one side will not be squeezed away ...

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Abstract

The invention relates to the technical field of chip analysis, and discloses a chip surface metal residue and contamination cleaning method. The method comprises the following steps of S1, placing a chip on a wafer; S2, spraying an organic reagent volatilized by heating; S3, covering a chip sample with an adhesive tape; S4, heating until the reagent volatilizes; S5, tearing off the adhesive tape after the reagent is volatilized. The organic reagent can clean the impurities on the wafer and the chip and also can protect the chip, and the influence of the static electricity on the chip during the cleaning process is eradicated. The organic reagent can adopt the reagent, such as ethyl alcohol, carbon tetrachloride, etc., and the impurities cannot move through the adhesive tape when the organic reagent volatilizes, and the positions of the impurities can be fixed, so that the impurities cannot touch the chip again, and the surface of the sample is effectively cleaned. A failure point can be found more easily, so that the FA success rate is increased.

Description

technical field [0001] The invention relates to the technical field of chip analysis, in particular to a method for cleaning metal residue and contamination on the chip surface. Background technique [0002] Chip delayering or Delayer is an essential step in the chip failure analysis, that is, chip FA process. It uses various processing methods such as ion etching, chemical liquid etching, and mechanical grinding to make the multi-layer structure of the chip itself removed layer by layer. Through chip grinding and delayering, it is possible to check whether there are defects layer by layer, and provide follow-up experiments to clearly analyze the circuit wiring structure of each layer. [0003] However, the samples after the total delay cannot be ground, and there will be a lot of metal residues on the surface and many small stains adsorbed. The metal residues and stains will lead to misjudgment of the FA of the chip, making it impossible to find the true cause of failure. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/683
CPCH01L21/02057H01L21/6836
Inventor 高峰黄勇超林廷伟
Owner 闳康技术检测(上海)有限公司
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