An electronic nameplate and its cnc numerical control cutting equipment

A technology for cutting equipment and nameplates, applied in the field of electronic nameplates and CNC numerical control cutting equipment, can solve the problems of air bubbles, the difficulty of fully bonding the protective film and the substrate surface, and affecting the bonding efficiency of the protective film, so as to reduce the air bubbles. Generate and improve the effect of lamination synthesis power and ensure lamination efficiency

Active Publication Date: 2021-06-18
美硕电子铭板(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing electronic nameplate has a protective film attached to both sides before installation to protect the surface of the electronic nameplate, and the metal-like layer on the surface of the substrate is usually a pattern of a certain shape, which makes it difficult to attach the protective film to the surface of the substrate Complete, forming a gap, resulting in the formation of air bubbles between the protective film and the substrate and between the protective film and the metalloid layer, affecting the bonding efficiency of the protective film

Method used

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  • An electronic nameplate and its cnc numerical control cutting equipment
  • An electronic nameplate and its cnc numerical control cutting equipment
  • An electronic nameplate and its cnc numerical control cutting equipment

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Embodiment Construction

[0032] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0033] refer to figure 1, is an electronic nameplate disclosed by the present invention, including a substrate 01 , a metalloid layer 02 , a UV adhesive layer 03 and a balance adhesive layer 04 , and the substrate 01 includes an acrylic board 011 and a PC board 012 . The acrylic plate 011 is in the shape of a rectangular plate, which is arranged horizontally, and its thickness is 0.5 mm. The PC board 012 is in the shape of a rectangular plate, which is arranged horizontally, and its bottom surface is overlapped with the upper surface of the acrylic board 011 and pasted and fixed. In addition, the thickness of the PC board 012 is 0.3 mm. The metalloid layer 02 is printed on the upper surface of the PC board 012 by an ink screen printing machine. When the ink is solidified, the thickness of the metalloid layer 02 is 0.1 mm, and the metalloid layer 02 extends a...

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Abstract

The invention relates to an electronic nameplate, which includes a substrate and a metal-like layer. The substrate includes an acrylic board and a PC board attached to the surface of the acrylic board. The metal-like layer is printed on the PC board by a screen printing machine. The plate is printed on the surface away from the acrylic plate, and the metal-like layer is formed by solidification of ink; the metal-like layer is in the shape of a frame, and the metal-like layer is filled with a UV adhesive layer, and the UV adhesive layer and The metal-like layer is bonded and fixed, one side surface of the UV adhesive layer is bonded and fixed to the surface of the PC board away from the acrylic board, and the other side surface is flush with the surface of the metal-like layer away from the PC board. The invention has the effect of preventing air bubbles and ensures the lamination efficiency of the protective film.

Description

technical field [0001] The invention relates to the technical field of nameplates, in particular to an electronic nameplate and CNC numerical control cutting equipment thereof. Background technique [0002] Electronic nameplate is a common component used in electronic products. It is often used in display panels and sign panels of electronic products. Electronic nameplates are usually substrates made of plastic materials such as PET, PVC or PC, and then formed on the surface of the substrate. Metal-like layer to enhance the texture of electronic products. The existing electronic nameplate has a protective film attached to both sides before installation to protect the surface of the electronic nameplate, and the metal-like layer on the surface of the substrate is usually a pattern of a certain shape, which makes it difficult to attach the protective film to the surface of the substrate Complete, forming a gap, resulting in the formation of air bubbles between the protective ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F7/00B32B27/30B32B27/08B32B27/36B32B33/00B23C3/28
CPCB23C3/28B32B27/08B32B27/308B32B27/365B32B33/00G09F7/00
Inventor 张恩扬冯国防
Owner 美硕电子铭板(深圳)有限公司
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