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Laminate molding method and laminate molding device

A technology of layered modeling and rotation direction, which is applied in the direction of coating devices, processing and manufacturing, manufacturing tools, etc., and can solve problems such as difficult-to-defect materials and large deformation

Inactive Publication Date: 2020-04-03
MITSUBISHI HEAVY IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since these existing technologies are all techniques of melting and molding materials, the amount of deformation is large, and it is difficult to apply to materials that cannot be melted and are prone to defects (such as 2000 series aluminum, etc.)

Method used

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  • Laminate molding method and laminate molding device
  • Laminate molding method and laminate molding device
  • Laminate molding method and laminate molding device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0055] like figure 1 As shown, the stack molding apparatus 1 according to Embodiment 1 includes a rotatably provided rotary tool 2 and a powder supply nozzle 3 as a supply means for supplying a metal powder material 9 . The powder supply nozzle 3 communicates with the storage part 4 that stores the powder material 9 . The powder material 9 may be supplied from the storage unit 4 to the powder supply nozzle 3 by the weight of the powder material 9 or by a feeder not shown.

[0056] The rotary tool 2 has a gripping portion 5 for being gripped by an unillustrated rotating device for rotating the rotary tool 2 , and a friction stirring portion 6 that contacts the powder material 9 and The flat front face 7 of the powder material 9 is friction stirred. A pin 8 is provided on the front end surface 7 so as to protrude from the front end surface 7 .

[0057] Next, a laminate forming method using the laminate forming apparatus 1 of Embodiment 1 will be described.

[0058] In Embodi...

Embodiment approach 2

[0066] Next, the laminate forming apparatus and the laminate forming method according to Embodiment 2 will be described. In the laminate forming apparatus and laminate forming method of the second embodiment, the structure of the rotary tool 2 is changed from that of the first embodiment. It should be noted that in Embodiment 2, the same components as those in Embodiment 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0067] like Figure 4 As shown, in Embodiment 2, the front end surface 7 of the friction stirring portion 6 of the rotary tool 2 includes a concave surface 20 and a ring-shaped flat surface 21 formed to surround the concave surface 20 . A frustoconical holding space 25 is delimited by the recessed surface 20 . In addition, a pin 8 is provided on the front end face 7 . The base end 8 b of the pin 8 is located on the concave surface 20 , and the front end 8 a of the pin 8 protrudes more than the most protruding p...

Embodiment approach 3

[0080] Next, the laminate forming apparatus and the laminate forming method according to Embodiment 3 will be described. In contrast to Embodiment 1, in Embodiment 3, the stack molding device and stack molding method are such that the rotary tool 2 is surrounded by guide members. It should be noted that in Embodiment 3, the same components as those in Embodiment 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0081] like Figure 9 As shown, the laminated molding apparatus 1 of Embodiment 3 includes: a rotatably provided rotary tool 2; a cylindrical guide member 30 that surrounds the rotary tool 2 along the rotation direction A of the rotary tool 2; and supplies the powder material 9 to The powder in the guide member 30 is supplied to the nozzle 3 .

[0082] like Figure 10 As shown, the friction stir portion 6 of the rotary tool 2 has a cylindrically shaped outer surface 6b. Although not an essential configuration in Embodi...

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PUM

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Abstract

Provided is a laminate molding method for laminating a metallic powder material onto a surface of a metallic base material for molding, the laminate molding method including the steps of feeding the powder material onto the surface of the base material, frictionally stirring the powder material and the surface to adhere the powder material to the surface without melting the powder material, feeding a powder material onto an adhesion section composed of the above-described power material adhered to the surface, and frictionally stirring the powder material and the adhesion section to adhere thepowder material to the adhesion section without melting the powder material.

Description

technical field [0001] The present disclosure relates to a layered molding method and a layered molding device for layering metal powder materials on a metal layering surface. Background technique [0002] Examples of existing 3D modeling technologies include laser welding (SLM), which is good at modeling complex microstructures, and laser metal deposition (LMD), which can achieve high-speed and local modeling without size restrictions. However, since these prior art technologies melt and shape materials, the amount of deformation is large, and it is difficult to apply to materials that cannot be melted and are prone to defects (for example, 2000 series aluminum, etc.). [0003] On the other hand, friction stir welding (FSW) is known as a joining technique rather than a molding technique, and it is possible to join parts to each other without melting the joining portion. FSW is a method that, while rotating a cylindrical tool with a protrusion at the tip, penetrates the pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/12
CPCB33Y10/00B29C64/153B29C64/209B33Y30/00B23K20/1215B23K20/122B23K20/128B23K20/1255Y02P10/25B22F12/224B22F10/25B22F12/53B22F3/105B23K20/12
Inventor 今泉阳登藤谷泰之石井建小室裕贵井上明子木村新太郎
Owner MITSUBISHI HEAVY IND LTD