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Control system, method, device and sub-module of modular multilevel converter

A modular multi-level control system technology, applied in the direction of output power conversion device, AC power input conversion to DC power output, electrical components, etc., can solve the security problem of centralized control mode, reduce the real-time performance of MMC, sub- Module can not work and other problems, to achieve the effect of overcoming security problems

Pending Publication Date: 2020-04-07
SIEMENS AG
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the centralized control approach has security issues
For example, when the central control unit fails, all sub-modules cannot work
Moreover, centralizing the control functions of all sub-modules to a unified central control unit may also reduce the real-time performance of MMC

Method used

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  • Control system, method, device and sub-module of modular multilevel converter
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  • Control system, method, device and sub-module of modular multilevel converter

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Embodiment Construction

[0078] In order to make the technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to illustrate the present invention, and are not intended to limit the protection scope of the present invention.

[0079] For the sake of brevity and intuition in description, the solution of the present invention is described below by describing several representative implementation manners. Numerous details in the embodiments are only used to help the understanding of the solutions of the present invention. But obviously, the technical solutions of the present invention may not be limited to these details when implemented. In order to avoid unnecessarily obscuring the solution of the present invention, some embodiments are not described in detail, but only a framework is ...

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Abstract

The embodiment of the invention discloses a control system, method, device and sub-module of a modular multilevel converter. The modular multilevel converter comprises N sub-modules, and the control system comprises: a control module which is used for transmitting a control instruction; and a concentrator connected with the N sub-modules and used for receiving the control instruction and sendingthe control instruction to the N sub-modules, wherein each sub-module in the N sub-modules is used for respectively determining a sub-module set adapted to execute the control instruction, and executing the control instruction when determining that the sub-module belongs to the sub-module set, N is a positive integer greater than or equal to 2. According to the embodiment of the invention, the technical scheme of the distributed control MMC is realized, and the safety problem of centralized control can be solved.

Description

technical field [0001] The present application relates to the field of modular multilevel converters (Modular Multilevel Converter, MMC), in particular to a control system, method, device and sub-module of a modular multilevel converter. Background technique [0002] MMC is a new type of voltage conversion circuit. It can superimpose and output high voltage by cascading multiple submodules. It also has the characteristics of less output harmonics and high modularity. Therefore, it is used in power systems. has broad application prospects. Currently common sub-module topologies include half-bridge sub-modules, full-bridge sub-modules, double-clamp sub-modules, and so on. Among them, the half-bridge sub-module is the most commonly used in engineering at present, but it does not have the DC fault ride-through capability, and needs to rely on the AC circuit breaker to cut off the fault current. Both the full-bridge sub-module and the double-clamp sub-module have DC fault ride-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/00
CPCH02M7/00H02M1/32H02M7/483H02M7/4835
Inventor 赵研峰姚吉隆
Owner SIEMENS AG
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