Chassis cooling structure
A heat dissipation structure and chassis technology, applied in the field of heat dissipation, can solve the problems of inconvenient installation, poor heat dissipation effect of the chassis, and the radiator occupies a large installation space, so as to achieve the effect of improving space utilization and improving heat dissipation effect.
Active Publication Date: 2021-12-31
SUNGROW POWER SUPPLY CO LTD
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Problems solved by technology
When there are many heat sources inside the case, the radiator will occupy a large amount of installation space in the case, and some radiators need to be connected with the outside of the case to cooperate, which is very inconvenient for the installation of various components inside the case
In addition, due to the limitation of safety regulations and reliability, some heating devices can hardly be directly attached to the substrate surface of the heat sink for heat dissipation, such as current-carrying copper bars or some heating devices with uneven outer surfaces, etc., the heat dissipation effect of the chassis is insufficient. good
Method used
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[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0033] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.
[0034] In addition,...
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The invention discloses a heat dissipation structure of a chassis. The heat dissipation structure of the chassis includes a chassis, a heat exchange component and a fan component. The chassis has a first heat dissipation chamber and a second heat dissipation chamber connected to each other. There are multiple heat sources. The chassis is provided with a liquid inlet for cooling liquid to flow in and a liquid outlet for cooling liquid to flow out. The heat exchange component is installed in the first heat dissipation chamber. The heat exchange component includes a heat exchanger. The liquid inlet and the liquid outlet are connected through liquid cooling pipes, and the fan assembly is installed in the first heat dissipation chamber or the second heat dissipation chamber, and is used to drive the air in the first heat dissipation chamber and the second heat dissipation chamber to circulate each other during operation And through the heat exchanger for heat exchange treatment. The invention improves the heat dissipation structure of the case, improves the heat dissipation capacity of the case through the combination of a liquid-cooled heat exchanger and a fan, and also improves the space utilization rate of the case.
Description
technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure of a chassis. Background technique [0002] There are usually a large number of electronic components and various heating devices inside the chassis of existing DC / DC converters, inverters, AC / DC power supplies and other equipment. The heat of these heating devices usually depends on the substrates of various radiators. Transfer the heat away. When there are many heat sources inside the case, the radiator will occupy a large amount of installation space in the case, and some radiators need to be connected with the outside of the case to cooperate, which is very inconvenient for the installation of various components inside the case. In addition, due to the limitation of safety regulations and reliability, some heating devices can hardly be directly attached to the substrate surface of the heat sink for heat dissipation, such as current-carry...
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IPC IPC(8): H05K7/20
CPCH05K7/20927H05K7/20909F28D1/05366F28D2021/0031F28D1/024H05K7/20609H05K7/202H05K7/20136H05K7/20254
Inventor 龚胜伟时晓蕾艾朋利陶高周
Owner SUNGROW POWER SUPPLY CO LTD