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A processing method of laser equipment

A technology for laser equipment and workpieces, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as complex structure, accident, inconvenience, etc., and achieve the effect of improving laser cutting parameters and cutting effect

Active Publication Date: 2021-07-20
中山市品尚激光科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the current laser cutting process, the cutting block can be affected by thermal deformation before being cut off and cannot be well supported on the workpiece, which is prone to cut off and cause accidents; the solution requires adding a fixture at the cutting end, which is complicated in structure and causes inconvenience. Class factor proposes a processing method for laser equipment

Method used

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  • A processing method of laser equipment

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Embodiment Construction

[0038] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0039] refer to figure 1 , a processing method of laser equipment, comprising the following steps:

[0040] S1. Calibrate the cutting trajectory path; according to the cutting requirements of the workpiece, calibrate the cutting trajectory path on the workpiece;

[0041] S2. Estimate the weight of the cutting block, and estimate the weight of the cutting block;

[0042] S3. Determine the reserved line segment on the cutting track path according to the estimated weight of the cutting block;

[0043] S4. Planning the circular cutting path, planning the circular cutting path according to the cuttin...

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Abstract

The invention discloses a processing method of laser equipment, comprising the following steps: calibrating a cutting track path; calibrating a cutting track path on the workpiece according to workpiece cutting requirements; Weight estimation, determine the reserved line segment on the cutting track path; plan the circumferential cutting path, plan the circumferential cutting path according to the cutting track path and the reserved line segment; fast and high-strength cutting the reserved line segment, truncate the cutting block; the calibrated cutting track The path includes the following steps: according to the cutting requirements of the workpiece, a cutting trajectory path is described on the workpiece; the invention provides a processing method of a laser equipment, for laser cutting the workpiece, setting a reserved line segment will cut the laser on the trajectory path except the reserved line segment. The cutting is turned on, and finally the reserved line segment is cut by rapid high-intensity laser cutting, and the cutting block is cut off, so that the cutting block can be well supported on the workpiece before cutting, and it is not easy to cut off and cause accidents.

Description

technical field [0001] The invention belongs to the technical field of laser cutting, in particular to a processing method of laser equipment. Background technique [0002] Laser cutting uses a high-energy-density laser beam to heat the workpiece, so that the temperature rises rapidly, reaching the boiling point of the material in a very short time, and the material begins to vaporize to form steam. These vapors are ejected at a high velocity, and at the same time as the vapors are ejected, incisions are formed in the material. With the continuous development of the storage tank industry in front of us, more and more industries and enterprises are using laser cutting, and more and more enterprises have entered the storage tank industry. It is still feasible to use this equipment in production. [0003] Laser cutting can be divided into four categories: laser vaporization cutting, laser melting cutting, laser oxygen cutting, and laser scribing and controlled fracture. Fold...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/70
CPCB23K26/38B23K26/70B23K26/702
Inventor 王少龙
Owner 中山市品尚激光科技有限公司
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