Sectional type heat dissipation film with edge sealing design

Abstract

The invention provides an edge sealing design sectional type heat dissipation film, which comprises an antistatic silica gel protection layer, a graphite layer, a copper foil double-sided adhesive tape and a PET double-sided antistatic release layer, wherein the antistatic silica gel protection layer, the graphite layer, the copper foil double-sided adhesive tape and the PET double-sided antistatic release layer are sequentially arranged in a stacked mode, the antistatic silica gel protection layer comprises a first protective film and a second protective film, the first protective film and the second protective film are arranged in a split mode, the graphite layer comprises a first graphite flake and a second graphite flake, the first graphite flake and the second graphite flake are integrally arranged, the PET double-sided antistatic release layer comprises a first antistatic release film and a second antistatic release film, the first antistatic release film and the second antistatic release film are arranged in a split mode, the first protective film, the first graphite flake and the first antistatic release film are stacked together to form a first heat dissipation section, and the second protective film, the second graphite flake, the copper foil double-sided adhesive tape and the second antistatic release film are stacked together to form a second heat dissipation section. According to the invention, the heat dissipation film adopts a sectional design, the continuous attachment of different areas on a main board can be realized through the same film product, the attachment operation of the heat dissipation film is simplified, and the efficiency of a production process is improved.

Description

technical field [0001] The invention relates to a film product, in particular to a segmented heat dissipation film with edge sealing design. Background technique [0002] For electronic products, it is often necessary to arrange functional film products inside the product to achieve corresponding purposes, such as heat dissipation and reflection. For notebooks, it is necessary to install film products capable of heat dissipation, insulation and other functions on the motherboard inside the notebook. However, due to the actual application environment, it is necessary to paste film products on different areas on both sides of the motherboard. In the prior art, the above-mentioned requirements are mainly met by adopting two membrane products. This method has the problems of low process efficiency and inconvenient operation. Therefore, in view of the above problems, it is necessary to propose a further solution. Contents of the invention [0003] The present invention aims...

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Problems solved by technology

This method has the problems of low process efficiency and inconvenient operation

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